Issued Patents All Time
Showing 51–75 of 108 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9522949 | Fusion protein for antagonizing angiogenesis inducible factors and uses thereof | Dong Li | 2016-12-20 |
| 9484259 | Semiconductor device and method of forming protection and support structure for conductive interconnect structure | Yaojian Lin, Kang Chen | 2016-11-01 |
| 9472452 | Semiconductor device and method of forming repassivation layer with reduced opening to contact pad of semiconductor die | Yaojian Lin, Kang Chen, Xia Feng | 2016-10-18 |
| 9451493 | Drive test minimization method and device for obtaining time delay | Dapeng Li, Lifeng Han, Zijiang Ma, He Huang, Feng He | 2016-09-20 |
| 9449925 | Integrated passive devices | Yaojian Lin, Haijing Cao, Qing Zhang, Kang Chen | 2016-09-20 |
| 9437552 | Semiconductor device and method of forming insulating layer around semiconductor die | Yaojian Lin, Kang Chen, Xia Feng, Xusheng Bao | 2016-09-06 |
| 9401331 | Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP | Yaojian Lin, Xusheng Bao, Kang Chen | 2016-07-26 |
| 9324700 | Semiconductor device and method of forming shielding layer over integrated passive device using conductive channels | Yaojian Lin, Kang Chen, Haijing Cao | 2016-04-26 |
| 9293401 | Semiconductor device and method for forming a low profile embedded wafer level ball grid array molded laser package (EWLP-MLP) | Seung Wook Yoon, Jose Alvin Caparas, Yaojian Lin, Pandi C. Marimuthu, Kang Chen +1 more | 2016-03-22 |
| 9273137 | FGFR-Fc fusion proteins and the use thereof | Dong Li | 2016-03-01 |
| 9269598 | Semiconductor device and method of forming an IPD over a high-resistivity encapsulant separated from other IPDS and baseband circuit | Yaojian Lin, Kang Chen, Haijing Cao | 2016-02-23 |
| 9252075 | Semiconductor device and method of forming a conductive via-in-via structure | Lionel Chien Hui Tay, Zigmund Ramirez Camacho | 2016-02-02 |
| 9202713 | Semiconductor device and method of forming RDL over contact pad with high alignment tolerance or reduced interconnect pitch | Yaojian Lin, Kang Chen, Xia Feng | 2015-12-01 |
| 9184103 | Semiconductor device having embedded integrated passive devices electrically interconnected using conductive pillars | Yaojian Lin, Haijing Cao, Kang Chen | 2015-11-10 |
| 9087930 | Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief | Yaojian Lin, Pandi C. Marimuthu, Kang Chen, Hin Hwa Goh, Yu Gu +4 more | 2015-07-21 |
| 9082832 | Semiconductor device and method of forming protection and support structure for conductive interconnect structure | Yaojian Lin, Kang Chen | 2015-07-14 |
| 9019881 | Method and system for waking up node B cell | Lifeng Han, Yin Gao | 2015-04-28 |
| 8977325 | Method and system for processing cell sleeping | Feng He, Yin Gao | 2015-03-10 |
| 8907476 | Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulation | Yaojian Lin, Kang Chen, Xia Feng | 2014-12-09 |
| 8878359 | Semiconductor device and method of forming insulating layer around semiconductor die | Yaojian Lin, Kang Chen, Xia Feng, Xusheng Bao | 2014-11-04 |
| 8843172 | Method and base station for determining an initial transmission power | Feng He | 2014-09-23 |
| 8796846 | Semiconductor device with a vertical interconnect structure for 3-D FO-WLCSP | Yaojian Lin, Xusheng Bao, Kang Chen | 2014-08-05 |
| 8786100 | Semiconductor device and method of forming repassivation layer with reduced opening to contact pad of semiconductor die | Yaojian Lin, Kang Chen, Xia Feng | 2014-07-22 |
| 8759155 | Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief | Yaojian Lin, Pandi C. Marimuthu, Kang Chen, Hin Hwa Goh, Yu Gu +4 more | 2014-06-24 |
| 8642446 | Semiconductor device and method of forming protective structure around semiconductor die for localized planarization of insulating layer | Yaojian Lin, Xia Feng, Kang Chen | 2014-02-04 |