Issued Patents All Time
Showing 26–50 of 108 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11146984 | Quality of service implementations for separating user plane | He Huang, Yin Gao | 2021-10-12 |
| 11137395 | SARS-CoV-2 (COVID-19) spike-AXL binding assay | Ruo-Pan Huang, Tuhin Das, Hao Tang, Shuhong Luo | 2021-10-05 |
| 11127666 | Semiconductor device and method of forming openings through insulating layer over encapsulant for enhanced adhesion of interconnect structure | Yaojian Lin, Kang Chen | 2021-09-21 |
| 11105804 | COVID-19 spike-ACE2 binding assay for drug and antibody screening | Ruo-Pan Huang, Hao Tang, Shuhong Luo | 2021-08-31 |
| 11066476 | Asymmetric bispecific antibody | Bingyu Li | 2021-07-20 |
| 10979933 | Method, network device, and system for implementing data processing, and storage medium | He Huang, Xiaojuan Shi | 2021-04-13 |
| 10805849 | Handover method and apparatus | Xiaojuan Shi | 2020-10-13 |
| 10772965 | Covalent linkers in antibody-drug conjugates and methods of making and using the same | Changjiang Huang, Hui Ye, Lezhi Zhang | 2020-09-15 |
| 10622293 | Semiconductor device and method for forming a low profile embedded wafer level ball grid array molded laser package (EWLB-MLP) | Seung Wook Yoon, Jose Alvin Caparas, Yaojian Lin, Pandi C. Marimuthu, Kang Chen +1 more | 2020-04-14 |
| 10607946 | Semiconductor device and method of forming interconnect substrate for FO-WLCSP | Yaojian Lin, Xia Feng, Kang Chen | 2020-03-31 |
| 10537644 | Covalent linkers in antibody-drug conjugates and methods of making and using the same | Chang Jiang Huang, Hui Ye, Lezhi Zhang | 2020-01-21 |
| 10211183 | Semiconductor device and method of forming shielding layer over integrated passive device using conductive channels | Yaojian Lin, Kang Chen, Haijing Cao | 2019-02-19 |
| 10204866 | Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulation | Yaojian Lin, Kang Chen, Xia Feng | 2019-02-12 |
| 10200948 | Method and device for controlling energy saving and compensation | Liping Chen, Weihong Zhu | 2019-02-05 |
| 10192801 | Semiconductor device and method of forming vertical interconnect structure in substrate for IPD and baseband circuit separated by high-resistivity molding compound | Yaojian Lin, Kang Chen, Haijing Cao | 2019-01-29 |
| 10163815 | Semiconductor device with dummy metal protective structure around semiconductor die for localized planarization of insulating layer | Yaojian Lin, Xia Feng, Kang Chen | 2018-12-25 |
| 10087260 | Anti-HER2 antibody and conjugate thereof | Changjiang Huang, Jing Jiang, Xuejing Yao, Hongwen Li, Qiaoyu Xu +1 more | 2018-10-02 |
| 9957313 | FGFR-FC fusion proteins and the use thereof | Dong Li | 2018-05-01 |
| 9865482 | Semiconductor device and method of forming a fan-out structure with integrated passive device and discrete component | Yaojian Lin, Kang Chen, Haijing Cao | 2018-01-09 |
| 9754867 | Semiconductor device and method of forming repassivation layer for robust low cost fan-out semiconductor package | Yaojian Lin, Kang Chen, Xia Feng | 2017-09-05 |
| 9679863 | Semiconductor device and method of forming interconnect substrate for FO-WLCSP | Yaojian Lin, Xia Feng, Kang Chen | 2017-06-13 |
| 9666500 | Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief | Yaojian Lin, Pandi C. Marimuthu, Kang Chen, Hin Hwa Goh, Yu Gu +4 more | 2017-05-30 |
| 9601434 | Semiconductor device and method of forming openings through insulating layer over encapsulant for enhanced adhesion of interconnect structure | Yaojian Lin, Kang Chen | 2017-03-21 |
| 9558958 | Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulation | Yaojian Lin, Kang Chen, Xia Feng | 2017-01-31 |
| 9548240 | Semiconductor device and method of forming repassivation layer for robust low cost fan-out semiconductor package | Yaojian Lin, Kang Chen, Xia Feng | 2017-01-17 |