HA

Hiroji Aga

SC Shin-Etsu Handotai Co.: 43 patents #5 of 679Top 1%
ST S.O.I. Tec Silicon On Insulator Technologies: 2 patents #64 of 155Top 45%
Overall (All Time): #65,291 of 4,157,543Top 2%
45
Patents All Time

Issued Patents All Time

Showing 26–45 of 45 patents

Patent #TitleCo-InventorsDate
7902042 Method of manufacturing SOI wafer and thus-manufactured SOI wafer Norihiro Kobayashi, Masayuki Imai, Tatsuo Enomoto, Hiroshi Takeno 2011-03-08
7560313 SOI wafer and method for producing the same Kiyoshi Mitani 2009-07-14
7524744 Method of producing SOI wafer and SOI wafer Isao Yokokawa, Kiyotaka Takano, Kiyoshi Mitani 2009-04-28
7521334 Method for producing direct bonded wafer and direct bonded wafer Norihiro Kobayashi, Toru Ishizuka, Tomohiko Ohta, Yasuo Nagaoka 2009-04-21
7320929 Method of fabricating SOI wafer Kiyoshi Mitani 2008-01-22
7288418 Process for treating substrates for the microelectronics industry, and substrates obtained by this process Thierry Barge, André Auberton-Herve, Naoto Tate 2007-10-30
7176102 Method for producing SOI wafer and SOI wafer Naota Tate, Susumu Kuwabara, Kiyoshi Mitani 2007-02-13
7029993 Method for treating substrates for microelectronics and substrates obtained according to said method Thierry Barge, André Auberton-Herve, Naoto Tate 2006-04-18
6998329 SOI wafer producing method, and wafer separating jig Hiroyuki Takahashi, Kiyoshi Mitani 2006-02-14
6897124 Method of manufacturing a bonded wafers using a Bernoulli chuck Naoto Tate 2005-05-24
6884696 Method for producing bonding wafer Shinichi Tomizawa, Kiyoshi Mitani 2005-04-26
6846718 Method for producing SOI wafer and SOI wafer Naoto Tate, Susumu Kuwabara, Kiyoshi Mitani 2005-01-25
6380551 Optical function device with photonic band gap and/or filtering characteristics Takao Abe 2002-04-30
6372609 Method of Fabricating SOI wafer by hydrogen ION delamination method and SOI wafer fabricated by the method Naoto Tate, Kiyoshi Mitani 2002-04-16
6362076 Method of fabricating an SOI wafer by hydrogen ion delamination without independent bonding heat treatment Yukio Inazuki, Norihiro Kobayashi, Kiyoshi Mitani 2002-03-26
6284628 Method of recycling a delaminated wafer and a silicon wafer used for the recycling Susumu Kuwahara, Kiyoshi Mitani, Masae Wada 2001-09-04
6239004 Method of forming oxide film on an SOI layer and method of fabricating a bonded wafer Kiyoshi Mitani, Masatake Nakano 2001-05-29
6238990 Method for heat treatment of SOI wafer and SOI wafer heat-treated by the method Norihiro Kobayashi, Kiyoshi Mitani 2001-05-29
6140210 Method of fabricating an SOI wafer and SOI wafer fabricated thereby Kiyoshi Mitani, Yukio Inazuki 2000-10-31
5998281 SOI wafer and method for the preparation thereof Kiyoshi Mitani, Masatake Katayama 1999-12-07