Issued Patents All Time
Showing 126–150 of 187 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6221509 | Semiconductor encapsulating epoxy resin compositions, and semiconductor devices encapsulated therewith | Tatsurou Hirano, Nobukazu Suzuki, Takayuki Aoki, Shoichi Osada | 2001-04-24 |
| 6210811 | Epoxy resin composition, laminate film using the same, and semiconductor device | Tsuyoshi Honda, Miyuki Wakao, Hisashi Shimizu | 2001-04-03 |
| 6207296 | Inorganic filler, epoxy resin composition, and semiconductor device | Noriaki Higuchi, Takaaki Fukumoto, Eiichi Asano, Kazutoshi Tomiyoshi | 2001-03-27 |
| 6177489 | Semiconductor encapsulating epoxy resin composition and semiconductor device | Satoshi Okuse, Kazutoshi Tomiyoshi, Takayuki Aoki, Eiichi Asano, Shigeki Ino | 2001-01-23 |
| 6168872 | Semiconductor encapsulating epoxy resin composition and semiconductor device | Kenji Ohashi, Tatsuya Ishizaki, Masayuki Umeno, Eiichi Asano, Shoichi Osada +1 more | 2001-01-02 |
| 6162878 | Semiconductor encapsulating epoxy resin composition and semiconductor device | Shoichi Osada, Kazutoshi Tomiyoshi, Eiichi Asano, Takayuki Aoki | 2000-12-19 |
| 6160078 | Semiconductor encapsulating epoxy resin composition and semiconductor device | Shoichi Osada, Takayuki Aoki, Kazutoshi Tomiyoshi | 2000-12-12 |
| 6143423 | Flame retardant epoxy resin compositions | Satoshi Okuse, Takayuki Aoki, Hideto Kato | 2000-11-07 |
| 6139978 | Semiconductor encapsulating epoxy resin compositions, and semiconductor devices encapsulated therewith | Kazuhiro Arai, Kazutoshi Tomiyoshi | 2000-10-31 |
| 6117953 | Liquid epoxy resin composition for ball grid array package | Nobuhiro Ichiroku | 2000-09-12 |
| 6103026 | Corrosion-resistant copper materials and making method | Masachika Yoshino, Naoya Noguchi | 2000-08-15 |
| 6084037 | Epoxy resin composition and semiconductor device | Hisashi Shimizu, Minoru Takei, Masachika Yoshino | 2000-07-04 |
| 6083774 | Method of fabricating a flip chip mold injected package | Kazuhiro Arai | 2000-07-04 |
| 6027812 | Encapsulant of crystalline epoxy resin and phenolic resin-crystalline epoxy resin reaction product | Takayuki Aoki, Shigeki Ino, Eiichi Asano, Satoshi Okuse, Kazutoshi Tomiyoshi | 2000-02-22 |
| 6001901 | Epoxy resin composition | Eiichi Asano, Shigeki Ino, Kazutoshi Tomiyoshi | 1999-12-14 |
| 5994785 | Epoxy resin compositions and semiconductor devices encapsulated therewith | Noriaki Higuchi, Koji Futatsumori, Chiat Hooi Keow, Hui Teng Teoh | 1999-11-30 |
| 5940688 | Epoxy resin composition and semiconductor device encapsulated therewith | Noriaki Higuchi, Takaaki Fukumoto, Eiichi Asano, Kazutoshi Tomiyoshi | 1999-08-17 |
| 5935314 | Inorganic filler, epoxy resin composition, and semiconductor device | Noriaki Higuchi, Takaaki Fukumoto, Eiichi Asano, Kazutoshi Tomiyoshi | 1999-08-10 |
| 5827908 | Naphthalene and or biphenyl skeleton containing epoxy resin composition | Kazuhiro Arai, Tadaharu Ikeda | 1998-10-27 |
| 5739187 | Semiconductor encapsulating epoxy resin compositions and semiconductor devices encapsulated therewith | Eiichi Asano, Takayuki Aoki, Peter Flury, Wolfgang Scharf, Tadashi Okada | 1998-04-14 |
| 5731370 | Semiconductor encapsulating epoxy resin compositions with 2-phenyl-4,5-dihydroxymethylimidazole curing accelerator | Kazuhiro Arai, Kazuo Dobashi, Tadaharu Ikeda | 1998-03-24 |
| 5700853 | Silicone rubber compositions | Takeo Yoshida, Syuuichi Azechi | 1997-12-23 |
| 5643975 | Epoxy resin compositions and cured products | Hisashi Shimizu | 1997-07-01 |
| 5473091 | Quaternary phosphorus compounds and their preparation | Nobuhiro Ichiroku, Koji Futatsumori, Kazuhiro Arai, Miyuki Wakao | 1995-12-05 |
| 5418266 | Epoxy resin compositions and semiconductor devices encapsulated therewith | Takayuki Aoki, Kazutoshi Tomiyoshi | 1995-05-23 |