Issued Patents All Time
Showing 76–100 of 187 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7169833 | Liquid epoxy resin composition and semiconductor device | Kazuaki Sumita, Kaoru Katoh, Tokue Kojima | 2007-01-30 |
| 7147920 | Wafer dicing/die bonding sheet | Nobuhiro Ichiroku, Hideki Akiba, Masachika Yoshino | 2006-12-12 |
| 7122587 | Semiconductor encapsulating flame retardant epoxy resin composition and semiconductor device | Tarou Shimoda, Shoichi Osada, Hiroyuki Takenaka, Shingo Ando, Kazutoshi Tomiyoshi | 2006-10-17 |
| 7094844 | Liquid epoxy resin composition and semiconductor device | Kazuaki Sumita, Shingo Ando | 2006-08-22 |
| 7095125 | Semiconductor encapsulating epoxy resin composition and semiconductor device | Shoichi Osada, Eiichi Asano, Shigeki Ino, Takayuki Aoki, Kazutoshi Tomiyoshi | 2006-08-22 |
| 7067930 | Liquid epoxy resin composition and semiconductor device | Kazuaki Sumita | 2006-06-27 |
| 7060786 | Heat resistant resin composition and adhesive film | Nobuhiro Ichiroku | 2006-06-13 |
| 7056772 | Method for sealing semiconductor component | Tsutomu Kashiwagi | 2006-06-06 |
| 7031591 | Optical waveguide, forming material and making method | Kinya Kodama, Tsutomu Kashiwagi | 2006-04-18 |
| 7026382 | Conductive resin composition | Hideki Akiba, Masachika Yoshino, Nobuhiro Ichiroku | 2006-04-11 |
| 6949294 | Radiation curing silicone rubber composition and adhesive silicone elastomer film | Tsutomu Kashiwagi | 2005-09-27 |
| 6949619 | Phenolic hydroxyl-bearing polyimide resin, making method and polyimide resin composition | Nobuhiro Ichiroku, Masachika Yoshino, Hideki Akiba | 2005-09-27 |
| 6894091 | Semiconductor encapsulating epoxy resin composition and semiconductor device | Shoichi Osada, Eiichi Asano, Kazutoshi Tomiyoshi, Takayuki Aoki, Shigeki Ino | 2005-05-17 |
| 6808819 | Heat resistant resin composition and adhesive film | Nobuhiro Ichiroku | 2004-10-26 |
| 6806509 | Light-emitting semiconductor potting composition and light-emitting semiconductor device | Masachika Yoshino | 2004-10-19 |
| 6794058 | Flip-chip type semiconductor device | Tsuyoshi Honda, Tatsuya Kanamaru, Eiichi Asano | 2004-09-21 |
| 6783859 | Semiconductor encapsulating flame retardant epoxy resin composition and semiconductor device | Shoichi Osada, Shingo Ando, Hiroyuki Takenaka, Kazutoshi Tomiyoshi | 2004-08-31 |
| 6780674 | Liquid epoxy resin composition and semiconductor device | Kazuaki Sumita, Haruyoshi Kuwabara | 2004-08-24 |
| 6733902 | Liquid epoxy resin composition and semiconductor device | Kazuaki Sumita, Tatsuya Kanamaru | 2004-05-11 |
| 6723452 | Semiconductor encapsulating epoxy resin composition and semiconductor device | Yasuo Kimura, Kazutoshi Tomiyoshi, Tarou Shimoda, Eiichi Asano, Takayuki Aoki | 2004-04-20 |
| 6709756 | Optical device-related adhesive and optical device | Haruyoshi Kuwabara, Miyuki Wakao | 2004-03-23 |
| 6709753 | Silicone-modified epoxy or phenolic resin compositions and semiconductor devices sealed therewith | Tsuyoshi Honda, Tatsuya Kanamaru | 2004-03-23 |
| 6680007 | Conductive resin compositions and electronic parts using the same | Tsuyoshi Honda | 2004-01-20 |
| 6645632 | Film-type adhesive for electronic components, and electronic components bonded therewith | Tsuyoshi Honda, Nobuhiro Ichiroku | 2003-11-11 |
| 6630745 | Semiconductor encapsulating epoxy resin composition and semiconductor device | Shoichi Osada, Eiichi Asano, Shigeki Ino, Takayuki Aoki, Kazutoshi Tomiyoshi | 2003-10-07 |