Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10669197 | Surface-modified glass fiber film | Saiko AKAHANE, Yoshihira Hamamoto, Shinsuke Yamaguchi, Toshio Shiobara | 2020-06-02 |
| 10242924 | Base-attached encapsulant for semiconductor encapsulation, semiconductor apparatus | Tomoaki Nakamura, Toshio Shiobara | 2019-03-26 |
| 10177059 | Method for manufacturing semiconductor apparatus using a base-attached encapsulant | Tomoaki Nakamura, Toshio Shiobara | 2019-01-08 |
| 9865518 | Electromagnetic wave shielding support base-attached encapsulant, encapsulated substrate having semicondutor devices mounted thereon, encapsulated wafer having semiconductor devices formed thereon, and semiconductor apparatus | Tomoaki Nakamura, Toshio Shiobara, Shinsuke Yamaguchi | 2018-01-09 |
| 9449856 | Encapsulant with base for use in semiconductor encapsulation, semiconductor apparatus, and method for manufacturing semiconductor apparatus | Tomoaki Nakamura, Toshio Shiobara, Susumu Sekiguchi | 2016-09-20 |
| 9401290 | Semiconductor apparatus and method for producing the same | Toshio Shiobara, Susumu Sekiguchi | 2016-07-26 |
| 9312197 | Support base-attached encapsulant, encapsulated substrate having semiconductor devices mounted thereon, encapsulated wafer having semiconductor devices formed thereon, semiconductor apparatus, and method for manufacturing semiconductor apparatus | Tomoaki Nakamura, Shinsuke Yamaguchi, Toshio Shiobara | 2016-04-12 |
| 9287174 | Fiber-containing resin substrate, device-mounting substrate and device-forming wafer, semiconductor apparatus, and method for producing semiconductor apparatus | Susumu Sekiguchi, Toshio Shiobara, Tomoaki Nakamura | 2016-03-15 |
| 9129912 | Encapsulant, encapsulated substrate having semiconductor devices mounting thereon, encapsulated wafer having semiconductor devices forming thereon, semiconductor apparatus, and method for manufacturing semiconductor apparatus | Toshio Shiobara, Susumu Sekiguchi, Tomoaki Nakamura | 2015-09-08 |
| 9129976 | Method of manufacturing semiconductor apparatus and semiconductor apparatus | Toshio Shiobara, Susumu Sekiguchi | 2015-09-08 |
| 8872358 | Sealant laminated composite, sealed semiconductor devices mounting substrate, sealed semiconductor devices forming wafer, semiconductor apparatus, and method for manufacturing semiconductor apparatus | Toshio Shiobara, Susumu Sekiguchi | 2014-10-28 |
| 8034893 | Resin resolution composition, polyimide resin, and semiconductor device | Toshio Shiobara | 2011-10-11 |
| 7714080 | Primer composition for semiconductor-encapsulating epoxy resin molding compound and semiconductor device | Toshio Shiobara | 2010-05-11 |
| 7683152 | Partial block polyimide-polysiloxane copolymer, making method, and resin composition comprising the copolymer | Nobuhiro Ichiroku, Toshio Shiobara | 2010-03-23 |
| 7147920 | Wafer dicing/die bonding sheet | Toshio Shiobara, Nobuhiro Ichiroku, Masachika Yoshino | 2006-12-12 |
| 7026382 | Conductive resin composition | Masachika Yoshino, Nobuhiro Ichiroku, Toshio Shiobara | 2006-04-11 |
| 6949619 | Phenolic hydroxyl-bearing polyimide resin, making method and polyimide resin composition | Nobuhiro Ichiroku, Masachika Yoshino, Toshio Shiobara | 2005-09-27 |