Issued Patents All Time
Showing 1–25 of 187 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12116304 | Method for packing quartz glass cloth | Hajime ITOKAWA, Ryunosuke Nomura | 2024-10-15 |
| 12098290 | Low dielectric silica powder, resin composition containing the silica powder, and method for manufacturing low dielectric silica powder | Hajime ITOKAWA | 2024-09-24 |
| 12035461 | Low dielectric substrate for high-speed millimeter-wave communication | Yusuke Taguchi, Ryunosuke Nomura | 2024-07-09 |
| 11920011 | Resin substrate having dielectric characteristics with little frequency dependence | Yusuke Taguchi, Ryunosuke Nomura, Hajime ITOKAWA | 2024-03-05 |
| 11802192 | Low dielectric resin substrate | Yusuke Taguchi, Hajime ITOKAWA | 2023-10-31 |
| 11678432 | Low dielectric substrate for high-speed millimeter-wave communication | Yusuke Taguchi, Ryunosuke Nomura | 2023-06-13 |
| 10818618 | Adhesive substrate, transfer device having adhesive substrate, and method for producing adhesive substrate | Hiroyuki IGUCHI, Tsutomu Kashiwagi | 2020-10-27 |
| 10763384 | Concentrating solar cell module | Wataru GOTO | 2020-09-01 |
| 10743412 | Substrate and semiconductor apparatus | Saiko AKAHANE, Yoshihira Hamamoto | 2020-08-11 |
| 10669197 | Surface-modified glass fiber film | Saiko AKAHANE, Yoshihira Hamamoto, Hideki Akiba, Shinsuke Yamaguchi | 2020-06-02 |
| 10308803 | Epoxy resin containing silicone-modified epoxy resin and polyvalent carboxylic acid compound, and cured product thereof | Junichi Sawada, Miyuki Wakao, Tsutomu Kashiwagi, Naofusa Miyagawa, Yoshihiro Kawada +1 more | 2019-06-04 |
| 10242924 | Base-attached encapsulant for semiconductor encapsulation, semiconductor apparatus | Tomoaki Nakamura, Hideki Akiba | 2019-03-26 |
| 10177059 | Method for manufacturing semiconductor apparatus using a base-attached encapsulant | Tomoaki Nakamura, Hideki Akiba | 2019-01-08 |
| 10134934 | Method for producing concentrating solar cell module and concentrating solar cell module | Wataru GOTO | 2018-11-20 |
| 9963542 | Silicone-modified epoxy resin, composition containing the epoxy resin, and cured product of same | Junichi Sawada, Miyuki Wakao, Tsutomu Kashiwagi, Naofusa Miyagawa, Yoshihiro Kawada +2 more | 2018-05-08 |
| 9944760 | Silicone-modified epoxy resin, composition containing said epoxy resin, and cured product thereof | Junichi Sawada, Miyuki Wakao, Tsutomu Kashiwagi, Naofusa Miyagawa, Yoshihiro Kawada +2 more | 2018-04-17 |
| 9902649 | Method for producing surface-treated glass fiber film and flexible fiber substrate | Yoshihira Hamamoto, Saiko AKAHANE | 2018-02-27 |
| 9865518 | Electromagnetic wave shielding support base-attached encapsulant, encapsulated substrate having semicondutor devices mounted thereon, encapsulated wafer having semiconductor devices formed thereon, and semiconductor apparatus | Hideki Akiba, Tomoaki Nakamura, Shinsuke Yamaguchi | 2018-01-09 |
| 9777107 | Silicone-modified epoxy resin and composition and cured article thereof | Junichi Sawada, Miyuki Wakao, Tsutomu Kashiwagi, Naofusa Miyagawa, Yoshihiro Kawada +3 more | 2017-10-03 |
| 9463997 | Composite particle, method of producing same, resin composition containing the particle, reflector formed from the composition, and light-emitting semiconductor device using the reflector | Yoshihiro TSUTSUMI | 2016-10-11 |
| 9449856 | Encapsulant with base for use in semiconductor encapsulation, semiconductor apparatus, and method for manufacturing semiconductor apparatus | Tomoaki Nakamura, Hideki Akiba, Susumu Sekiguchi | 2016-09-20 |
| 9401290 | Semiconductor apparatus and method for producing the same | Susumu Sekiguchi, Hideki Akiba | 2016-07-26 |
| 9397271 | UV- and heat-resistant optoelectronic semiconductor component | Harald Jaeger, Joerg Sorg, Tsutomu Kashiwagi | 2016-07-19 |
| 9312197 | Support base-attached encapsulant, encapsulated substrate having semiconductor devices mounted thereon, encapsulated wafer having semiconductor devices formed thereon, semiconductor apparatus, and method for manufacturing semiconductor apparatus | Hideki Akiba, Tomoaki Nakamura, Shinsuke Yamaguchi | 2016-04-12 |
| 9287174 | Fiber-containing resin substrate, device-mounting substrate and device-forming wafer, semiconductor apparatus, and method for producing semiconductor apparatus | Susumu Sekiguchi, Hideki Akiba, Tomoaki Nakamura | 2016-03-15 |