Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12421435 | Adhesive composition for flexible printed-wiring board (FPC), and heat-curable resin film, prepreg and FPC substrate containing same | Atsushi TSUURA, Hiroyuki IGUCHI, Yuki Kudo, Masayuki Iwasaki, Rina SASAHARA | 2025-09-23 |
| 12264270 | Method for producing cured product of heat-curable maleimide resin composition | — | 2025-04-01 |
| 12162971 | Heat-curable maleimide resin composition | Yuki Kudo, Shinsuke Yamaguchi | 2024-12-10 |
| 12012485 | Heat-curable citraconimide resin composition | Naoyuki KUSHIHARA, Rina SASAHARA | 2024-06-18 |
| 11773100 | Bismaleimide compound and production method thereof | Yuki Kudo | 2023-10-03 |
| 11639410 | Heat-curable resin composition and uses thereof | Hiroki HORIGOME, Shoichi Osada | 2023-05-02 |
| 11608438 | Low-dielectric heat dissipation film composition and low-dielectric heat dissipation film | Hiroyuki IGUCHI, Yoshinori Takamatsu, Yuki Kudo, Atsushi TSUURA | 2023-03-21 |
| 11530324 | Slurry composition, cured product of the slurry composition, and substrate, film and prepreg using the cured product | Hiroyuki IGUCHI, Yuki Kudo, Atsushi TSUURA | 2022-12-20 |
| 11059973 | Heat-curable resin composition and semiconductor device | Naoyuki KUSHIHARA, Norifumi Kawamura, Yoshihira Hamamoto, Yuki Kudo | 2021-07-13 |
| 11046848 | Heat-curable resin composition for semiconductor encapsulation and semiconductor device | Naoyuki KUSHIHARA, Yuki Kudo, Norifumi Kawamura, Yoshihira Hamamoto | 2021-06-29 |
| 10865304 | Heat-curable resin composition, heat-curable resin film and semiconductor device | Naoyuki KUSHIHARA, Yuki Kudo, Kazuaki Sumita, Yoshihira Hamamoto | 2020-12-15 |
| 10808102 | Thermosetting epoxy resin sheet for encapsulating semiconductor, semiconductor equipment, and method for manufacturing the same | Shuichi Fujii, Kenji Hagiwara, Kazuaki Sumita | 2020-10-20 |
| 10793712 | Heat-curable resin composition for semiconductor encapsulation and semiconductor device | Naoyuki KUSHIHARA, Norifumi Kawamura, Yuki Kudo | 2020-10-06 |
| 10600707 | Fiber-containing resin substrate, encapsulated semiconductor devices mounting substrate, encapsulated semiconductor devices forming wafer, encapsulated semiconductor devices mounting sheet, semiconductor equipment, and method for manufacturing semiconductor equipment | Shuichi Fujii, Kenji Hagiwara, Shinsuke Yamaguchi | 2020-03-24 |
| 10388837 | White heat-curable epoxy resin composition for optical semiconductor element encapsulation and optical semiconductor device using same | Tadashi Tomita | 2019-08-20 |
| 10008646 | Heat-curable epoxy resin composition for optical semiconductor element encapsulation and optical semiconductor device using same | Tadashi Tomita | 2018-06-26 |
| 9884960 | White heat-curable epoxy resin composition, optical semiconductor element case made of the white heat-curable epoxy resin composition and optical semiconductor device comprised of the case | Tadashi Tomita | 2018-02-06 |
| 9463997 | Composite particle, method of producing same, resin composition containing the particle, reflector formed from the composition, and light-emitting semiconductor device using the reflector | Toshio Shiobara | 2016-10-11 |
| 9441104 | Heat-curable epoxy resin composition for optical semiconductor element encapsulation and optical semiconductor device using same | Tadashi Tomita | 2016-09-13 |
| 9403983 | White thermosetting silicone resin composition for a light-emitting semiconductor device and a case for installing a light-emitting semiconductor element | Tadashi Tomita | 2016-08-02 |
| 9209085 | Wafer processing method | Fumio Uchida | 2015-12-08 |
| 8933158 | Thermosetting silicone resin composition for reflector of LED, reflector for LED using the same and optical semiconductor apparatus | Toshio Shiobara, Tsutomu Kashiwagi, Yoshihira Hamamoto | 2015-01-13 |
| 8877849 | Thermosetting silicone resin composition for reflector of LED, reflector for LED using the same and optical semiconductor apparatus | Toshio Shiobara, Tsutomu Kashiwagi, Takayuki KUSUNOKI | 2014-11-04 |
| 5286124 | Platen knob | — | 1994-02-15 |