Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12421435 | Adhesive composition for flexible printed-wiring board (FPC), and heat-curable resin film, prepreg and FPC substrate containing same | Yoshihiro TSUTSUMI, Hiroyuki IGUCHI, Yuki Kudo, Masayuki Iwasaki, Rina SASAHARA | 2025-09-23 |
| 11608438 | Low-dielectric heat dissipation film composition and low-dielectric heat dissipation film | Hiroyuki IGUCHI, Yoshinori Takamatsu, Yuki Kudo, Yoshihiro TSUTSUMI | 2023-03-21 |
| 11530324 | Slurry composition, cured product of the slurry composition, and substrate, film and prepreg using the cured product | Yoshihiro TSUTSUMI, Hiroyuki IGUCHI, Yuki Kudo | 2022-12-20 |