Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11608438 | Low-dielectric heat dissipation film composition and low-dielectric heat dissipation film | Hiroyuki IGUCHI, Yuki Kudo, Atsushi TSUURA, Yoshihiro TSUTSUMI | 2023-03-21 |
| 11541580 | Method for preparing compact of resin compound having anisotropy | Tetsuo Oka, Takeshi Fukuda | 2023-01-03 |
| 11104099 | Thermally conductive resin sheet having light transmission and method for producing the same | Kazuaki Sumita | 2021-08-31 |
| 10590242 | Method for producing hydrosilyl group-containing organic silicon resin | Takuya Abe, Hiroomi IYOKU, Masanao Kamei | 2020-03-17 |
| 9228107 | (Meth)allylsilane compound, silane coupling agent thereof, and functional material using the same | Toyoshi Shimada | 2016-01-05 |