Issued Patents All Time
Showing 1–25 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11984327 | Method for producing power module, and power module | Naoyuki KUSHIHARA, Masahiro KANETA | 2024-05-14 |
| 11104099 | Thermally conductive resin sheet having light transmission and method for producing the same | Yoshinori Takamatsu | 2021-08-31 |
| 10865304 | Heat-curable resin composition, heat-curable resin film and semiconductor device | Naoyuki KUSHIHARA, Yuki Kudo, Yoshihiro TSUTSUMI, Yoshihira Hamamoto | 2020-12-15 |
| 10850482 | Resin composition, resin film, semiconductor laminate, method for manufacturing semiconductor laminate, and method for manufacturing semiconductor device | Yoichiro Ichioka, Naoyuki KUSHIHARA, Kazunori Kondo | 2020-12-01 |
| 10829589 | Heat-curable resin composition | Naoyuki KUSHIHARA | 2020-11-10 |
| 10808102 | Thermosetting epoxy resin sheet for encapsulating semiconductor, semiconductor equipment, and method for manufacturing the same | Yoshihiro TSUTSUMI, Shuichi Fujii, Kenji Hagiwara | 2020-10-20 |
| 10730273 | Resin composition, resin film, semiconductor laminate, method for manufacturing semiconductor laminate, and method for manufacturing semiconductor device | Yoichiro Ichioka, Naoyuki KUSHIHARA, Kazunori Kondo | 2020-08-04 |
| 10407536 | Heat-curable resin composition for semiconductor encapsulation | Naoyuki KUSHIHARA | 2019-09-10 |
| 10385203 | Heat-curable resin composition for semiconductor encapsulation | Tomoaki Nakamura, Naoyuki KUSHIHARA | 2019-08-20 |
| 9972507 | Method for encapsulating large-area semiconductor element-mounted base material | Naoyuki KUSHIHARA | 2018-05-15 |
| 9711378 | Liquid epoxy resin composition for semiconductor sealing and resin-sealed semiconductor device | Tatsuya Uehara, Naoyuki KUSHIHARA | 2017-07-18 |
| 9382421 | Heat-curable resin composition | Naoyuki KUSHIHARA | 2016-07-05 |
| 9018281 | Set of resin compositions for preparing system-in-package type semiconductor device | Kaoru Katoh, Taro Shimoda | 2015-04-28 |
| 8828806 | Dam composition for use with multilayer semiconductor package underfill material, and fabrication of multilayer semiconductor package using the same | — | 2014-09-09 |
| 7642661 | Liquid epoxy resin composition | Masatoshi Asano, Kaoru Katoh | 2010-01-05 |
| 7169833 | Liquid epoxy resin composition and semiconductor device | Kaoru Katoh, Tokue Kojima, Toshio Shiobara | 2007-01-30 |
| 7094844 | Liquid epoxy resin composition and semiconductor device | Shingo Ando, Toshio Shiobara | 2006-08-22 |
| 7067930 | Liquid epoxy resin composition and semiconductor device | Toshio Shiobara | 2006-06-27 |
| 6780674 | Liquid epoxy resin composition and semiconductor device | Haruyoshi Kuwabara, Toshio Shiobara | 2004-08-24 |
| 6733902 | Liquid epoxy resin composition and semiconductor device | Tatsuya Kanamaru, Toshio Shiobara | 2004-05-11 |
| 6558812 | Liquid epoxy resin composition and semiconductor device | Toshio Shiobara | 2003-05-06 |
| 6534193 | Liquid epoxy resin composition and semiconductor device | Toshio Shiobara | 2003-03-18 |
| 6479167 | Sealing material for flip-chip semiconductor device, and flip-chip semiconductor device made therewith | Toshio Shiobara | 2002-11-12 |
| 6429238 | Flip-chip type semiconductor device sealing material and flip-chip type semiconductor device | Kimitaka Kumagae, Miyuki Wakao, Toshio Shiobara | 2002-08-06 |
| 6376100 | Flip-chip type semiconductor device underfill material and flip-chip type semiconductor device | Toshio Shiobara | 2002-04-23 |