Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12305036 | Epoxy resin composition for semiconductor encapsulation and semiconductor device | Shoichi Osada, Hiroki Oishi, Norifumi Kawamura, Kenji Hagiwara, Ryuhei Yokota | 2025-05-20 |
| 11984327 | Method for producing power module, and power module | Naoyuki KUSHIHARA, Kazuaki Sumita | 2024-05-14 |