Issued Patents All Time
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12305036 | Epoxy resin composition for semiconductor encapsulation and semiconductor device | Hiroki Oishi, Norifumi Kawamura, Kenji Hagiwara, Ryuhei Yokota, Masahiro KANETA | 2025-05-20 |
| 11639410 | Heat-curable resin composition and uses thereof | Hiroki HORIGOME, Yoshihiro TSUTSUMI | 2023-05-02 |
| 11028269 | Silicone-modified epoxy resin composition and semiconductor device | Norifumi Kawamura, Kohei Otake | 2021-06-08 |
| 10851261 | Semiconductor-encapsulating epoxy resin composition and semiconductor device | Hiroki Oishi, Ryuhei Yokota, Munenao HIROKAMI | 2020-12-01 |
| 10676635 | Silicone-modified epoxy resin composition and semiconductor device | Norifumi Kawamura | 2020-06-09 |
| 9633921 | Semiconductor encapsulation resin composition and semiconductor device comprised of cured product of the semiconductor encapsulation resin composition | Naoyuki KUSHIHARA, Ryuhei Yokota | 2017-04-25 |
| 8796375 | Prepreg, metal-clad laminate, printed wiring board, and semiconductor device | — | 2014-08-05 |
| 8048969 | Semiconductor encapsulating epoxy resin composition and semiconductor device | Yasuo Kimura, Eiichi Asano, Toshio Shiobara | 2011-11-01 |
| 8022137 | Silicone resin composition for optical semiconductor devices | Yusuke Taguchi, Junichi Sawada, Kenji Hagiwara, Kazutoshi Tomiyoshi | 2011-09-20 |
| 7999016 | Semiconductor encapsulating epoxy resin composition and semiconductor device | Eiji Nakayama | 2011-08-16 |
| 7969027 | Semiconductor device encapsulated with resin composition | — | 2011-06-28 |
| 7910638 | Semiconductor-encapsulating epoxy resin composition, preparation method, and semiconductor device | Tomoyoshi Tada, Miyuki Wakao, Kazutoshi Tomiyoshi, Kenichi Totsuka, Tadaharu Ikeda | 2011-03-22 |
| 7898094 | Epoxy resin composition for encapsulating semiconductor devices and semiconductor devices encapsulated therewith | Takayuki Aoki | 2011-03-01 |
| 7511383 | Flame retardant and an epoxy resin composition comprising the same for encapsulating semiconductor devices | — | 2009-03-31 |
| 7122587 | Semiconductor encapsulating flame retardant epoxy resin composition and semiconductor device | Tarou Shimoda, Hiroyuki Takenaka, Shingo Ando, Kazutoshi Tomiyoshi, Toshio Shiobara | 2006-10-17 |
| 7095125 | Semiconductor encapsulating epoxy resin composition and semiconductor device | Eiichi Asano, Shigeki Ino, Takayuki Aoki, Kazutoshi Tomiyoshi, Toshio Shiobara | 2006-08-22 |
| 6894091 | Semiconductor encapsulating epoxy resin composition and semiconductor device | Toshio Shiobara, Eiichi Asano, Kazutoshi Tomiyoshi, Takayuki Aoki, Shigeki Ino | 2005-05-17 |
| 6783859 | Semiconductor encapsulating flame retardant epoxy resin composition and semiconductor device | Shingo Ando, Hiroyuki Takenaka, Kazutoshi Tomiyoshi, Toshio Shiobara | 2004-08-31 |
| 6630745 | Semiconductor encapsulating epoxy resin composition and semiconductor device | Eiichi Asano, Shigeki Ino, Takayuki Aoki, Kazutoshi Tomiyoshi, Toshio Shiobara | 2003-10-07 |
| 6518332 | Semiconductor encapsulating epoxy resin compositions, and semiconductor devices encapsulated therewith | Eiichi Asano, Kazutoshi Tomiyoshi, Masachika Yoshino, Toshio Shiobara | 2003-02-11 |
| 6297306 | Semiconductor encapsulating epoxy resin composition and semiconductor device | Takayuki Aoki, Toshio Shiobara, Kazutoshi Tomiyoshi, Eiichi Asano | 2001-10-02 |
| 6291556 | Semiconductor encapsulating epoxy resin composition and semiconductor device | Eiichi Asano, Shigeki Ino, Takayuki Aoki, Kazutoshi Tomiyoshi, Toshio Shiobara | 2001-09-18 |
| 6274251 | Semiconductor encapsulating epoxy resin composition and semiconductor device | Kenji Ohashi, Tatsuya Ishizaki, Masayuki Umeno, Eiichi Asano, Kazutoshi Tomiyoshi +1 more | 2001-08-14 |
| 6221509 | Semiconductor encapsulating epoxy resin compositions, and semiconductor devices encapsulated therewith | Tatsurou Hirano, Nobukazu Suzuki, Toshio Shiobara, Takayuki Aoki | 2001-04-24 |
| 6168872 | Semiconductor encapsulating epoxy resin composition and semiconductor device | Kenji Ohashi, Tatsuya Ishizaki, Masayuki Umeno, Eiichi Asano, Kazutoshi Tomiyoshi +1 more | 2001-01-02 |