Issued Patents All Time
Showing 1–25 of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9303115 | Thermosetting epoxy resin composition and semiconductor device | Masaki Hayashi, Yusuke Taguchi, Tomoyoshi Tada | 2016-04-05 |
| 8022137 | Silicone resin composition for optical semiconductor devices | Yusuke Taguchi, Junichi Sawada, Kenji Hagiwara, Shoichi Osada | 2011-09-20 |
| 8013056 | White heat-curable silicone resin composition, optoelectronic part case, and molding method | Yusuke Taguchi, Tomoyoshi Tada, Hisashi Shimizu | 2011-09-06 |
| 8013057 | White thermosetting silicone resin composition for molding an optical semiconductor case and optical semiconductor case | Yusuke Taguchi | 2011-09-06 |
| 7910638 | Semiconductor-encapsulating epoxy resin composition, preparation method, and semiconductor device | Tomoyoshi Tada, Shoichi Osada, Miyuki Wakao, Kenichi Totsuka, Tadaharu Ikeda | 2011-03-22 |
| 7122587 | Semiconductor encapsulating flame retardant epoxy resin composition and semiconductor device | Tarou Shimoda, Shoichi Osada, Hiroyuki Takenaka, Shingo Ando, Toshio Shiobara | 2006-10-17 |
| 7095125 | Semiconductor encapsulating epoxy resin composition and semiconductor device | Shoichi Osada, Eiichi Asano, Shigeki Ino, Takayuki Aoki, Toshio Shiobara | 2006-08-22 |
| 6894091 | Semiconductor encapsulating epoxy resin composition and semiconductor device | Shoichi Osada, Toshio Shiobara, Eiichi Asano, Takayuki Aoki, Shigeki Ino | 2005-05-17 |
| 6783859 | Semiconductor encapsulating flame retardant epoxy resin composition and semiconductor device | Shoichi Osada, Shingo Ando, Hiroyuki Takenaka, Toshio Shiobara | 2004-08-31 |
| 6723452 | Semiconductor encapsulating epoxy resin composition and semiconductor device | Yasuo Kimura, Tarou Shimoda, Eiichi Asano, Takayuki Aoki, Toshio Shiobara | 2004-04-20 |
| 6630745 | Semiconductor encapsulating epoxy resin composition and semiconductor device | Shoichi Osada, Eiichi Asano, Shigeki Ino, Takayuki Aoki, Toshio Shiobara | 2003-10-07 |
| 6569532 | Epoxy resin compositions and premolded semiconductor packages | Kazuhiro Arai, Toshio Shiobara, Koki Oitori, Hironori Sakamoto, Yuji Kishigami +2 more | 2003-05-27 |
| 6518332 | Semiconductor encapsulating epoxy resin compositions, and semiconductor devices encapsulated therewith | Eiichi Asano, Masachika Yoshino, Toshio Shiobara, Shoichi Osada | 2003-02-11 |
| 6399677 | Epoxy resin compositions and premolded semiconductor packages | Kazuhiro Arai, Toshio Shiobara | 2002-06-04 |
| 6297306 | Semiconductor encapsulating epoxy resin composition and semiconductor device | Shoichi Osada, Takayuki Aoki, Toshio Shiobara, Eiichi Asano | 2001-10-02 |
| 6291556 | Semiconductor encapsulating epoxy resin composition and semiconductor device | Shoichi Osada, Eiichi Asano, Shigeki Ino, Takayuki Aoki, Toshio Shiobara | 2001-09-18 |
| 6274251 | Semiconductor encapsulating epoxy resin composition and semiconductor device | Kenji Ohashi, Tatsuya Ishizaki, Masayuki Umeno, Eiichi Asano, Shoichi Osada +1 more | 2001-08-14 |
| 6231997 | Semiconductor encapsulating epoxy resin compositions, and semiconductor devices | Kazuhiro Arai, Toshio Shiobara | 2001-05-15 |
| 6207296 | Inorganic filler, epoxy resin composition, and semiconductor device | Noriaki Higuchi, Takaaki Fukumoto, Toshio Shiobara, Eiichi Asano | 2001-03-27 |
| 6177489 | Semiconductor encapsulating epoxy resin composition and semiconductor device | Satoshi Okuse, Toshio Shiobara, Takayuki Aoki, Eiichi Asano, Shigeki Ino | 2001-01-23 |
| 6168872 | Semiconductor encapsulating epoxy resin composition and semiconductor device | Kenji Ohashi, Tatsuya Ishizaki, Masayuki Umeno, Eiichi Asano, Shoichi Osada +1 more | 2001-01-02 |
| 6162878 | Semiconductor encapsulating epoxy resin composition and semiconductor device | Shoichi Osada, Eiichi Asano, Takayuki Aoki, Toshio Shiobara | 2000-12-19 |
| 6160078 | Semiconductor encapsulating epoxy resin composition and semiconductor device | Shoichi Osada, Toshio Shiobara, Takayuki Aoki | 2000-12-12 |
| 6139978 | Semiconductor encapsulating epoxy resin compositions, and semiconductor devices encapsulated therewith | Kazuhiro Arai, Toshio Shiobara | 2000-10-31 |
| 6027812 | Encapsulant of crystalline epoxy resin and phenolic resin-crystalline epoxy resin reaction product | Toshio Shiobara, Takayuki Aoki, Shigeki Ino, Eiichi Asano, Satoshi Okuse | 2000-02-22 |