Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6569532 | Epoxy resin compositions and premolded semiconductor packages | Kazutoshi Tomiyoshi, Kazuhiro Arai, Toshio Shiobara, Hironori Sakamoto, Yuji Kishigami +2 more | 2003-05-27 |