Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10308803 | Epoxy resin containing silicone-modified epoxy resin and polyvalent carboxylic acid compound, and cured product thereof | Toshio Shiobara, Junichi Sawada, Tsutomu Kashiwagi, Naofusa Miyagawa, Yoshihiro Kawada +1 more | 2019-06-04 |
| 9963542 | Silicone-modified epoxy resin, composition containing the epoxy resin, and cured product of same | Toshio Shiobara, Junichi Sawada, Tsutomu Kashiwagi, Naofusa Miyagawa, Yoshihiro Kawada +2 more | 2018-05-08 |
| 9944760 | Silicone-modified epoxy resin, composition containing said epoxy resin, and cured product thereof | Toshio Shiobara, Junichi Sawada, Tsutomu Kashiwagi, Naofusa Miyagawa, Yoshihiro Kawada +2 more | 2018-04-17 |
| 9777107 | Silicone-modified epoxy resin and composition and cured article thereof | Toshio Shiobara, Junichi Sawada, Tsutomu Kashiwagi, Naofusa Miyagawa, Yoshihiro Kawada +3 more | 2017-10-03 |
| 9660157 | Addition-curable silicone resin composition and die attach material for optical semiconductor device | Tatsuya Yamazaki, Tsutomu Kashiwagi | 2017-05-23 |
| 9147818 | Wavelength conversion sheet filled with large amount of phosphor, method of producing light emitting semiconductor device using the sheet, and light emitting semiconductor device | Toshio Shiobara, Tsutomu Kashiwagi | 2015-09-29 |
| 8710158 | Epoxy composition for encapsulating an optical semiconductor element | Manabu Ueno, Tsutomu Kashiwagi | 2014-04-29 |
| 8133957 | Resin composition for encapsulating optical semiconductor element | Yoshihira Hamamoto, Toshio Shiobara, Tsutomu Kashiwagi | 2012-03-13 |
| 7985806 | Diglycidylisocyanuryl-modified organopolysiloxane and composition containing the same | Toshio Shiobara, Tsutomu Kashiwagi, Manabu Ueno | 2011-07-26 |
| 7910638 | Semiconductor-encapsulating epoxy resin composition, preparation method, and semiconductor device | Tomoyoshi Tada, Shoichi Osada, Kazutoshi Tomiyoshi, Kenichi Totsuka, Tadaharu Ikeda | 2011-03-22 |
| 6709756 | Optical device-related adhesive and optical device | Haruyoshi Kuwabara, Toshio Shiobara | 2004-03-23 |
| 6512031 | Epoxy resin composition, laminate film using the same, and semiconductor device | Tsuyoshi Honda, Toshio Shiobara | 2003-01-28 |
| 6506822 | Epoxy resin composition | Nobuhiro Ichiroku, Toshio Shiobara | 2003-01-14 |
| 6429238 | Flip-chip type semiconductor device sealing material and flip-chip type semiconductor device | Kazuaki Sumita, Kimitaka Kumagae, Toshio Shiobara | 2002-08-06 |
| 6383659 | Epoxy resin composition, laminate film using the same, and semiconductor device | Tsuyoshi Honda, Toshio Shiobara | 2002-05-07 |
| 6376923 | Flip-chip type semiconductor device sealing material and flip-chip type semiconductor device | Kazuaki Sumita, Kimitaka Kumagae, Toshio Shiobara | 2002-04-23 |
| 6294271 | Flip-chip type semiconductor device sealing material and flip-chip type semiconductor device | Kazuaki Sumita, Kimitaka Kumagae, Toshio Shiobara | 2001-09-25 |
| 6225704 | Flip-chip type semiconductor device | Kazuaki Sumita, Kimitaka Kumagae, Toshio Shiobara | 2001-05-01 |
| 6210811 | Epoxy resin composition, laminate film using the same, and semiconductor device | Tsuyoshi Honda, Hisashi Shimizu, Toshio Shiobara | 2001-04-03 |
| 5473091 | Quaternary phosphorus compounds and their preparation | Nobuhiro Ichiroku, Koji Futatsumori, Kazuhiro Arai, Toshio Shiobara | 1995-12-05 |
| 5336786 | Organic silicon compounds | Toshio Shiobara, Koji Futatsumori, Satoshi Okuse, Takayuki Aoki, Shigeki Ino | 1994-08-09 |