KF

Koji Futatsumori

SC Shin-Etsu Chemical Co.: 27 patents #160 of 2,176Top 8%
Mitsubishi Electric: 1 patents #15,491 of 25,717Top 65%
NC Nippondenso Co.: 1 patents #1,765 of 3,479Top 55%
Overall (All Time): #147,719 of 4,157,543Top 4%
27
Patents All Time

Issued Patents All Time

Showing 1–25 of 27 patents

Patent #TitleCo-InventorsDate
7534840 Room temperature-curable organopolysiloxane compositions Takayuki Matsuzawa 2009-05-19
5994785 Epoxy resin compositions and semiconductor devices encapsulated therewith Noriaki Higuchi, Chiat Hooi Keow, Hui Teng Teoh, Toshio Shiobara 1999-11-30
5473091 Quaternary phosphorus compounds and their preparation Nobuhiro Ichiroku, Kazuhiro Arai, Miyuki Wakao, Toshio Shiobara 1995-12-05
5362775 Epoxy resin composition and cured product thereof Akira Shintai, Hiroshi Shibata, Toshio Shiobara, Seizi Katayama, Yasutaka Yoshida 1994-11-08
5362887 Fluorine - modified acid anhydrides Toshio Shiobara, Kazuhiro Arai, Hisashi Shimizu, Shigeki Ino 1994-11-08
5336786 Organic silicon compounds Toshio Shiobara, Satoshi Okuse, Takayuki Aoki, Miyuki Wakao, Shigeki Ino 1994-08-09
5248710 Flip chip encapsulating compositions and semiconductor devices encapsulated therewith Toshio Shiobara, Shinichi Jingu 1993-09-28
5235005 Polyimide resin composition and semiconductor device encapsulated therewith Toshio Shiobara, Shinichi Jingu 1993-08-10
5198479 Light transmissive epoxy resin compositions and optical semiconductor devices encapsulated therewith Toshio Shiobara, Kazuhiro Arai 1993-03-30
5175199 High transparency silica-titania glass beads, method for making, and light transmission epoxy resin compositions Eiichi Asano, Takaaki Shimizu, Masatoshi Takita, Toshio Shiobara, Kazuhiro Arai 1992-12-29
5166228 Epoxy resin compositions containing polysubstituted novolac epoxy resins and naphthylene based phenolic resin curing agents and semiconductor devices encapsulated therewith Toshio Shiobara, Kazutoshi Tomiyoshi, Takashi Tsuchiya, Takayuki Aoki 1992-11-24
5137940 Semiconductor encapsulating epoxy resin compositions Kazutoshi Tomiyoshi, Toshio Shiobara, Hatuji Shiraishi 1992-08-11
5053445 Epoxy resin composition Kunio Itoh, Toshio Shiobara, Kazutoshi Tomiyoshi, Hisashi Shimizu 1991-10-01
5006614 Epoxy resin composition and semiconductor device encapsulated therewith containing polymaleimide and (allyl-epoxy)novolac/siloxane graft copolymer Kunio Itoh, Toshio Shiobara 1991-04-09
4891434 Novel organosilicon compound Toshio Takago, Masatoshi Arai 1990-01-02
4877822 Epoxy resin composition Kunio Itoh, Toshio Shiobara, Kazutoshi Tomiyoshi, Hisashi Shimizu 1989-10-31
4761454 Method for the preparation of fine spherical particles of silicone elastomer Toshio Oba, Takeshi Mihama 1988-08-02
4701482 Epoxy resin composition for encapsulation of semiconductor devices Kunio Itoh, Toshio Shiobara, Kazutoshi Tomiyoshi, Hisashi Shimizu 1987-10-20
4618646 Room temperature-curable organopolysiloxane composition Toshio Takago, Masatoshi Arai 1986-10-21
4579963 Organosilicon compound and a room temperature curable organopolysiloxane composition formulated therewith Masatoshi Arai, Takeo Inoue, Shinichi Sato 1986-04-01
4577041 Cyclic organopolysiloxane compound Masatoshi Arai, Takeo Inoue, Shinichi Sato 1986-03-18
4339563 Novel organopolysiloxanes and room temperature curable organopolysiloxane compositions containing the same Toshio Takago, Masatoshi Arai 1982-07-13
4323488 Method for the preparation of silicone-modified polyoxyalkylene polyethers and room temperature-curable compositions therewith Toshio Takago, Masatoshi Arai 1982-04-06
4304920 Novel organosilane compounds Masatoshi Arai 1981-12-08
4302571 Room temperature-curable polyoxyalkylene polyether compositions Masatoshi Arai 1981-11-24