NI

Nobuhiro Ichiroku

SC Shin-Etsu Chemical Co.: 17 patents #260 of 2,176Top 15%
Overall (All Time): #273,878 of 4,157,543Top 7%
17
Patents All Time

Issued Patents All Time

Showing 1–17 of 17 patents

Patent #TitleCo-InventorsDate
10704008 Heat-conductive silicone grease composition 2020-07-07
8617705 Adhesive composition and sheet for forming semiconductor wafer-protective film 2013-12-31
7820742 Adhesive exhibiting maximum melt viscosity of 10,000 Pa s at 40 to 80 degrees C Shouhei Kozakai 2010-10-26
7722949 Adhesive composition and adhesive film therefrom 2010-05-25
7683152 Partial block polyimide-polysiloxane copolymer, making method, and resin composition comprising the copolymer Hideki Akiba, Toshio Shiobara 2010-03-23
7488539 Adhesive composition and sheet having an adhesive layer of the composition Shouhei Kozakai 2009-02-10
7364797 Adhesive composition and adhesive film Shouhei Kozakai, Akio Suzuki, Toshio Shiobara 2008-04-29
7244495 Dicing/die bonding adhesion tape Shouhei Kozakai, Akio Suzuki, Toshio Shiobara 2007-07-17
7147920 Wafer dicing/die bonding sheet Toshio Shiobara, Hideki Akiba, Masachika Yoshino 2006-12-12
7060786 Heat resistant resin composition and adhesive film Toshio Shiobara 2006-06-13
7026382 Conductive resin composition Hideki Akiba, Masachika Yoshino, Toshio Shiobara 2006-04-11
6949619 Phenolic hydroxyl-bearing polyimide resin, making method and polyimide resin composition Masachika Yoshino, Hideki Akiba, Toshio Shiobara 2005-09-27
6808819 Heat resistant resin composition and adhesive film Toshio Shiobara 2004-10-26
6645632 Film-type adhesive for electronic components, and electronic components bonded therewith Tsuyoshi Honda, Toshio Shiobara 2003-11-11
6506822 Epoxy resin composition Miyuki Wakao, Toshio Shiobara 2003-01-14
6117953 Liquid epoxy resin composition for ball grid array package Toshio Shiobara 2000-09-12
5473091 Quaternary phosphorus compounds and their preparation Koji Futatsumori, Kazuhiro Arai, Miyuki Wakao, Toshio Shiobara 1995-12-05