Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8522815 | Gas shutoff device | Takuhisa Ootani, Kouji Murase | 2013-09-03 |
| 8496023 | Temporary drainage system and temporary drainage method | — | 2013-07-30 |
| 8110066 | Adhesive composition suitable to be applied by screen printing | Tatsuya Kanamaru | 2012-02-07 |
| 7901992 | Die bonding agent and a semiconductor device made by using the same | Tatsuya Kanemaru | 2011-03-08 |
| 7855245 | Adhesive composition and a method of using the same | Tatsuya Kanemaru, Shinsuke Yamaguchi | 2010-12-21 |
| 7169474 | Epoxy resin composition and semiconductor device | — | 2007-01-30 |
| 6794058 | Flip-chip type semiconductor device | Tatsuya Kanamaru, Eiichi Asano, Toshio Shiobara | 2004-09-21 |
| 6709753 | Silicone-modified epoxy or phenolic resin compositions and semiconductor devices sealed therewith | Toshio Shiobara, Tatsuya Kanamaru | 2004-03-23 |
| 6680007 | Conductive resin compositions and electronic parts using the same | Toshio Shiobara | 2004-01-20 |
| 6645632 | Film-type adhesive for electronic components, and electronic components bonded therewith | Nobuhiro Ichiroku, Toshio Shiobara | 2003-11-11 |
| 6627328 | Light-transmissive epoxy resin composition and semiconductor device | Tatsuya Kanamaru, Eiichi Asano, Toshio Shiobara | 2003-09-30 |
| 6512031 | Epoxy resin composition, laminate film using the same, and semiconductor device | Miyuki Wakao, Toshio Shiobara | 2003-01-28 |
| 6383659 | Epoxy resin composition, laminate film using the same, and semiconductor device | Miyuki Wakao, Toshio Shiobara | 2002-05-07 |
| 6210811 | Epoxy resin composition, laminate film using the same, and semiconductor device | Miyuki Wakao, Hisashi Shimizu, Toshio Shiobara | 2001-04-03 |