Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7901992 | Die bonding agent and a semiconductor device made by using the same | Tsuyoshi Honda | 2011-03-08 |
| 7855245 | Adhesive composition and a method of using the same | Tsuyoshi Honda, Shinsuke Yamaguchi | 2010-12-21 |