EA

Eiichi Asano

SC Shin-Etsu Chemical Co.: 21 patents #217 of 2,176Top 10%
KC Komatsu Electronic Metals Co.: 3 patents #33 of 160Top 25%
HC Hokko Chemical Industry Co.: 2 patents #30 of 157Top 20%
Mitsubishi Electric: 2 patents #11,187 of 25,717Top 45%
CI Ciba-Geigy: 1 patents #1,572 of 2,867Top 55%
Overall (All Time): #155,965 of 4,157,543Top 4%
26
Patents All Time

Issued Patents All Time

Showing 1–25 of 26 patents

Patent #TitleCo-InventorsDate
8048969 Semiconductor encapsulating epoxy resin composition and semiconductor device Shoichi Osada, Yasuo Kimura, Toshio Shiobara 2011-11-01
7943706 Semiconductor encapsulating epoxy resin composition and semiconductor device Yasuo Kimura, Toshio Shiobara, Takayuki Aoki 2011-05-17
7432603 Semiconductor encapsulating epoxy resin composition and semiconductor device Toshio Shiobara 2008-10-07
7095125 Semiconductor encapsulating epoxy resin composition and semiconductor device Shoichi Osada, Shigeki Ino, Takayuki Aoki, Kazutoshi Tomiyoshi, Toshio Shiobara 2006-08-22
6894091 Semiconductor encapsulating epoxy resin composition and semiconductor device Shoichi Osada, Toshio Shiobara, Kazutoshi Tomiyoshi, Takayuki Aoki, Shigeki Ino 2005-05-17
6794058 Flip-chip type semiconductor device Tsuyoshi Honda, Tatsuya Kanamaru, Toshio Shiobara 2004-09-21
6723452 Semiconductor encapsulating epoxy resin composition and semiconductor device Yasuo Kimura, Kazutoshi Tomiyoshi, Tarou Shimoda, Takayuki Aoki, Toshio Shiobara 2004-04-20
6630745 Semiconductor encapsulating epoxy resin composition and semiconductor device Shoichi Osada, Shigeki Ino, Takayuki Aoki, Kazutoshi Tomiyoshi, Toshio Shiobara 2003-10-07
6627328 Light-transmissive epoxy resin composition and semiconductor device Tatsuya Kanamaru, Tsuyoshi Honda, Toshio Shiobara 2003-09-30
6518332 Semiconductor encapsulating epoxy resin compositions, and semiconductor devices encapsulated therewith Kazutoshi Tomiyoshi, Masachika Yoshino, Toshio Shiobara, Shoichi Osada 2003-02-11
6297306 Semiconductor encapsulating epoxy resin composition and semiconductor device Shoichi Osada, Takayuki Aoki, Toshio Shiobara, Kazutoshi Tomiyoshi 2001-10-02
6291556 Semiconductor encapsulating epoxy resin composition and semiconductor device Shoichi Osada, Shigeki Ino, Takayuki Aoki, Kazutoshi Tomiyoshi, Toshio Shiobara 2001-09-18
6274251 Semiconductor encapsulating epoxy resin composition and semiconductor device Kenji Ohashi, Tatsuya Ishizaki, Masayuki Umeno, Kazutoshi Tomiyoshi, Shoichi Osada +1 more 2001-08-14
6207296 Inorganic filler, epoxy resin composition, and semiconductor device Noriaki Higuchi, Takaaki Fukumoto, Toshio Shiobara, Kazutoshi Tomiyoshi 2001-03-27
6177489 Semiconductor encapsulating epoxy resin composition and semiconductor device Satoshi Okuse, Kazutoshi Tomiyoshi, Toshio Shiobara, Takayuki Aoki, Shigeki Ino 2001-01-23
6168872 Semiconductor encapsulating epoxy resin composition and semiconductor device Kenji Ohashi, Tatsuya Ishizaki, Masayuki Umeno, Shoichi Osada, Kazutoshi Tomiyoshi +1 more 2001-01-02
6162878 Semiconductor encapsulating epoxy resin composition and semiconductor device Shoichi Osada, Kazutoshi Tomiyoshi, Takayuki Aoki, Toshio Shiobara 2000-12-19
6027812 Encapsulant of crystalline epoxy resin and phenolic resin-crystalline epoxy resin reaction product Toshio Shiobara, Takayuki Aoki, Shigeki Ino, Satoshi Okuse, Kazutoshi Tomiyoshi 2000-02-22
6001901 Epoxy resin composition Toshio Shiobara, Shigeki Ino, Kazutoshi Tomiyoshi 1999-12-14
5990022 Method of evaluating a silicon wafer Hisami Motoura 1999-11-23
5940688 Epoxy resin composition and semiconductor device encapsulated therewith Noriaki Higuchi, Takaaki Fukumoto, Toshio Shiobara, Kazutoshi Tomiyoshi 1999-08-17
5935314 Inorganic filler, epoxy resin composition, and semiconductor device Noriaki Higuchi, Takaaki Fukumoto, Toshio Shiobara, Kazutoshi Tomiyoshi 1999-08-10
5904568 Method of manufacturing a semiconductor wafer Masahiko Maeda, Takamitsu Harada, Hisami Motoura 1999-05-18
5897327 Method of evaluating a semiconductor wafer Hisami Motoura, Yasuhiro Shimada 1999-04-27
5739187 Semiconductor encapsulating epoxy resin compositions and semiconductor devices encapsulated therewith Takayuki Aoki, Toshio Shiobara, Peter Flury, Wolfgang Scharf, Tadashi Okada 1998-04-14