Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12146057 | Cyclic imide resin composition, prepreg, copper-clad laminate and printed-wiring board | Hiroyuki IGUCHI, Masayuki Iwasaki | 2024-11-19 |
| 12110356 | Heat-curable resin composition | Rina SASAHARA | 2024-10-08 |
| 12012485 | Heat-curable citraconimide resin composition | Yoshihiro TSUTSUMI, Rina SASAHARA | 2024-06-18 |
| 11984327 | Method for producing power module, and power module | Kazuaki Sumita, Masahiro KANETA | 2024-05-14 |
| 11059973 | Heat-curable resin composition and semiconductor device | Yoshihiro TSUTSUMI, Norifumi Kawamura, Yoshihira Hamamoto, Yuki Kudo | 2021-07-13 |
| 11046848 | Heat-curable resin composition for semiconductor encapsulation and semiconductor device | Yoshihiro TSUTSUMI, Yuki Kudo, Norifumi Kawamura, Yoshihira Hamamoto | 2021-06-29 |
| 10865304 | Heat-curable resin composition, heat-curable resin film and semiconductor device | Yuki Kudo, Kazuaki Sumita, Yoshihiro TSUTSUMI, Yoshihira Hamamoto | 2020-12-15 |
| 10850482 | Resin composition, resin film, semiconductor laminate, method for manufacturing semiconductor laminate, and method for manufacturing semiconductor device | Yoichiro Ichioka, Kazuaki Sumita, Kazunori Kondo | 2020-12-01 |
| 10829589 | Heat-curable resin composition | Kazuaki Sumita | 2020-11-10 |
| 10793712 | Heat-curable resin composition for semiconductor encapsulation and semiconductor device | Yoshihiro TSUTSUMI, Norifumi Kawamura, Yuki Kudo | 2020-10-06 |
| 10730273 | Resin composition, resin film, semiconductor laminate, method for manufacturing semiconductor laminate, and method for manufacturing semiconductor device | Yoichiro Ichioka, Kazunori Kondo, Kazuaki Sumita | 2020-08-04 |
| 10407536 | Heat-curable resin composition for semiconductor encapsulation | Kazuaki Sumita | 2019-09-10 |
| 10385203 | Heat-curable resin composition for semiconductor encapsulation | Kazuaki Sumita, Tomoaki Nakamura | 2019-08-20 |
| 9972507 | Method for encapsulating large-area semiconductor element-mounted base material | Kazuaki Sumita | 2018-05-15 |
| 9711378 | Liquid epoxy resin composition for semiconductor sealing and resin-sealed semiconductor device | Kazuaki Sumita, Tatsuya Uehara | 2017-07-18 |
| 9633921 | Semiconductor encapsulation resin composition and semiconductor device comprised of cured product of the semiconductor encapsulation resin composition | Shoichi Osada, Ryuhei Yokota | 2017-04-25 |
| 9382421 | Heat-curable resin composition | Kazuaki Sumita | 2016-07-05 |