Issued Patents All Time
Showing 1–25 of 50 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| D1070795 | Stamp component for transferring microstructure | Yoshinori Ogawa, Nobuaki Tomura, Nobuaki Matsumoto, Akira Sakamoto, Taichi KITAGAWA | 2025-04-15 |
| D1070796 | Stamp component for transferring microstructure | Yoshinori Ogawa, Nobuaki Tomura, Nobuaki Matsumoto, Akira Sakamoto, Taichi KITAGAWA | 2025-04-15 |
| D1054388 | Carrier substrate for handling | Yoshinori Ogawa, Nobuaki Tomura, Nobuaki Matsumoto, Akira Sakamoto, Taichi KITAGAWA | 2024-12-17 |
| 11862755 | Method for fabricating (LED) dice using laser lift-off from a substrate to a receiving plate | Chen-Fu Chu, Shih-Kai Chan, Yi-Feng Shih, David Trung Doan, Trung T. Doan +7 more | 2024-01-02 |
| 11862754 | Method for fabricating (LED) dice using semiconductor structures on a substrate and laser lift-off to a receiving plate | Chen-Fu Chu, Shih-Kai Chan, Yi-Feng Shih, David Trung Doan, Trung T. Doan +7 more | 2024-01-02 |
| 11693317 | Photosensitive resin composition, pattern forming process, and fabrication of opto-semiconductor device | Hitoshi Maruyama | 2023-07-04 |
| 11526078 | Photosensitive resin composition, photosensitive resin coating, photosensitive dry film, laminate, and pattern forming process | Hitoshi Maruyama | 2022-12-13 |
| 11518876 | Photosensitive resin composition and photosensitive dry film | Yoichiro Ichioka | 2022-12-06 |
| 11417799 | Method for fabricating (LED) dice using laser lift-off from a substrate to a receiving plate | Chen-Fu Chu, Shih-Kai Chan, Yi-Feng Shih, David Trung Doan, Trung T. Doan +7 more | 2022-08-16 |
| 11402756 | Silicone structure-containing polymer, photosensitive resin composition, photosensitive resin coating, photosensitive dry film, laminate, and pattern forming process | Hitoshi Maruyama | 2022-08-02 |
| 11294282 | Epoxy-containing, isocyanurate-modified silicone resin, photosensitive resin composition, photosensitive dry film, laminate, and pattern forming process | Kumiko Hayashi, Hitoshi Maruyama, Hideto Kato | 2022-04-05 |
| 11156919 | Photosensitive resin composition, pattern forming process, and fabrication of opto-semiconductor device | Hitoshi Maruyama | 2021-10-26 |
| 10850482 | Resin composition, resin film, semiconductor laminate, method for manufacturing semiconductor laminate, and method for manufacturing semiconductor device | Yoichiro Ichioka, Naoyuki KUSHIHARA, Kazuaki Sumita | 2020-12-01 |
| 10796939 | Temporary adhesive film roll for substrate processing, method for manufacturing thin wafer | Masahito Tanabe, Michihiro Sugo, Hiroyuki Yasuda | 2020-10-06 |
| 10730273 | Resin composition, resin film, semiconductor laminate, method for manufacturing semiconductor laminate, and method for manufacturing semiconductor device | Yoichiro Ichioka, Naoyuki KUSHIHARA, Kazuaki Sumita | 2020-08-04 |
| 10719015 | Positive resist film laminate and pattern forming process | Yoshinori Hirano, Satoshi Asai | 2020-07-21 |
| 10538630 | Silicone-modified polybenzoxazole resin and making method | Hitoshi Maruyama, Ryuto HAYASHI, Hideyoshi Yanagisawa | 2020-01-21 |
| 10514601 | Chemically amplified positive resist film laminate and pattern forming process | Yoshinori Hirano, Satoshi Asai | 2019-12-24 |
| 10503067 | Photosensitive resin composition, photosensitive dry film, photosensitive resin coating, and pattern forming process | Hitoshi Maruyama, Hideyoshi Yanagisawa | 2019-12-10 |
| 10451970 | Silicone skeleton-containing polymer, photo-curable resin composition, photo-curable dry film, laminate, and patterning process | Hitoshi Maruyama, Michihiro Sugo | 2019-10-22 |
| 10428239 | Resin composition, resin film, method for producing resin film, method for producing semiconductor device, and semiconductor device | Yoichiro Ichioka | 2019-10-01 |
| 10377923 | Surface protective film, making method, and substrate processing laminate | Yoichiro Ichioka | 2019-08-13 |
| 10373903 | Laminate and making method | Hiroyuki Yasuda, Michihiro Sugo, Hideto Kato | 2019-08-06 |
| 10319653 | Semiconductor apparatus, stacked semiconductor apparatus, encapsulated stacked-semiconductor apparatus, and method for manufacturing the same | Katsuya Takemura, Kyoko Soga, Satoshi Asai, Michihiro Sugo, Hideto Kato | 2019-06-11 |
| 10308787 | Resin composition, resin film, method for producing resin film, method for producing semiconductor device, and semiconductor device | Yoichiro Ichioka, Michihiro Sugo | 2019-06-04 |