HK

Hideto Kato

SC Shin-Etsu Chemical Co.: 96 patents #14 of 2,176Top 1%
MC Menicon Co.: 2 patents #89 of 263Top 35%
PA Panasonic: 1 patents #13,264 of 21,108Top 65%
Overall (All Time): #14,266 of 4,157,543Top 1%
101
Patents All Time

Issued Patents All Time

Showing 1–25 of 101 patents

Patent #TitleCo-InventorsDate
11294282 Epoxy-containing, isocyanurate-modified silicone resin, photosensitive resin composition, photosensitive dry film, laminate, and pattern forming process Kumiko Hayashi, Hitoshi Maruyama, Kazunori Kondo 2022-04-05
11262655 Photosensitive resin composition, photosensitive dry film, and pattern forming process Hitoshi Maruyama, Michihiro Sugo 2022-03-01
10991611 Wafer processing laminate and method for processing wafer Shohei Tagami, Michihiro Sugo 2021-04-27
10982053 Polymer containing silphenylene and polyether structures Hitoshi Maruyama, Michihiro Sugo 2021-04-20
10948823 Laminate and pattern forming method Satoshi Asai, Kyoko Soga 2021-03-16
10658314 Wafer laminate, method for production thereof, and adhesive composition for wafer laminate Hiroyuki Yasuda, Michihiro Sugo 2020-05-19
10553552 Wafer laminate and method of producing the same Hiroyuki Yasuda, Michihiro Sugo 2020-02-04
10453732 Wafer laminate and making method Hiroyuki Yasuda, Michihiro Sugo 2019-10-22
10416559 Film material and pattern forming process Satoshi Asai, Kyoko Soga 2019-09-17
10373903 Laminate and making method Hiroyuki Yasuda, Michihiro Sugo, Kazunori Kondo 2019-08-06
10319653 Semiconductor apparatus, stacked semiconductor apparatus, encapsulated stacked-semiconductor apparatus, and method for manufacturing the same Katsuya Takemura, Kyoko Soga, Satoshi Asai, Kazunori Kondo, Michihiro Sugo 2019-06-11
10297485 Semiconductor device, making method, and laminate Hiroyuki Yasuda, Michihiro Sugo, Kazunori Kondo 2019-05-21
10141272 Semiconductor apparatus, stacked semiconductor apparatus and encapsulated stacked-semiconductor apparatus each having photo-curable resin layer Katsuya Takemura, Kyoko Soga, Satoshi Asai, Kazunori Kondo, Michihiro Sugo 2018-11-27
10128143 Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer Masahito Tanabe, Michihiro Sugo, Hiroyuki Yasuda, Shohei Tagami 2018-11-13
10115622 Wafer processing laminate and method for processing wafer Shohei Tagami, Michihiro Sugo 2018-10-30
10026650 Resin composition, resin film, semiconductor device and method of manufacture thereof Kazunori Kondo, Yoichiro Ichioka 2018-07-17
9971242 Photo-curable resin composition and photo-curable dry film using the same Satoshi Asai, Kyoko Soga 2018-05-15
9887118 Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer Shohei Tagami, Michihiro Sugo, Masahito Tanabe 2018-02-06
9653335 Wafer processing laminate, wafer processing member, temporary bonding arrangement, and thin wafer manufacturing method Michihiro Sugo, Shohei Tagami 2017-05-16
9650538 Method for manufacturing micro-structure Hiroshi Kanbara, Tomoyoshi Furihata, Yoshinori Hirano 2017-05-16
9472438 Wafer processing laminate, wafer processing member, temporary adhering material for processing wafer, and manufacturing method of thin wafer Kazunori Kondo, Michihiro Sugo, Shohei Tagami, Hiroyuki Yasuda 2016-10-18
9458365 Temporary bonding adhesive compositions and methods of manufacturing a semiconductor device using the same Tae Hoon Kim, Jae-Hyun Kim, Jun-Won Han, Hiroyuki Yasuda, Shohei Tagami +2 more 2016-10-04
9447305 Silicone resin, resin composition, resin film, semiconductor device, and making method Kazunori Kondo, Yoichiro Ichioka 2016-09-20
9365681 Wafer processing laminate, wafer processing member, temporary bonding arrangement, and thin wafer manufacturing method Michihiro Sugo, Shohei Tagami 2016-06-14
9334424 Temporary adhesive for wafer processing, member for wafer processing using the same, wafer processed body, and method for producing thin wafer Masahito Tanabe, Michihiro Sugo, Shohei Tagami, Hiroyuki Yasuda 2016-05-10