Issued Patents All Time
Showing 1–25 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12322637 | Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer | Mitsuo Muto, Michihiro Sugo | 2025-06-03 |
| 12187989 | Cleaning solution for temporary adhesive for substrates, substrate cleaning method, and cleaning method for support or substrate | Michihiro Sugo, Masahito Tanabe | 2025-01-07 |
| 11970639 | Temporary adhesive for wafer processing, wafer laminate and method for producing thin wafer | Mitsuo Muto, Michihiro Sugo | 2024-04-30 |
| 10991611 | Wafer processing laminate and method for processing wafer | Michihiro Sugo, Hideto Kato | 2021-04-27 |
| 10854496 | Circuit substrate processing laminate and method for processing circuit substrate | Michihiro Sugo | 2020-12-01 |
| 10242902 | Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer | Michihiro Sugo, Hiroyuki Yasuda, Masahito Tanabe | 2019-03-26 |
| 10147632 | Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer | Michihiro Sugo, Hiroyuki Yasuda, Masahito Tanabe | 2018-12-04 |
| 10128143 | Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer | Masahito Tanabe, Michihiro Sugo, Hiroyuki Yasuda, Hideto Kato | 2018-11-13 |
| 10115622 | Wafer processing laminate and method for processing wafer | Michihiro Sugo, Hideto Kato | 2018-10-30 |
| 10106713 | Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer | Michihiro Sugo | 2018-10-23 |
| 9934996 | Wafer processing bonding arrangement, wafer laminate, and thin wafer manufacturing method | Michihiro Sugo, Hiroyuki Yasuda, Masahito Tanabe | 2018-04-03 |
| 9887118 | Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer | Michihiro Sugo, Masahito Tanabe, Hideto Kato | 2018-02-06 |
| 9653335 | Wafer processing laminate, wafer processing member, temporary bonding arrangement, and thin wafer manufacturing method | Hideto Kato, Michihiro Sugo | 2017-05-16 |
| 9646868 | Wafer temporary bonding method and thin wafer manufacturing method | Hiroyuki Yasuda, Michihiro Sugo, Masahito Tanabe | 2017-05-09 |
| 9472438 | Wafer processing laminate, wafer processing member, temporary adhering material for processing wafer, and manufacturing method of thin wafer | Kazunori Kondo, Hideto Kato, Michihiro Sugo, Hiroyuki Yasuda | 2016-10-18 |
| 9458365 | Temporary bonding adhesive compositions and methods of manufacturing a semiconductor device using the same | Tae Hoon Kim, Hideto Kato, Jae-Hyun Kim, Jun-Won Han, Hiroyuki Yasuda +2 more | 2016-10-04 |
| 9365681 | Wafer processing laminate, wafer processing member, temporary bonding arrangement, and thin wafer manufacturing method | Hideto Kato, Michihiro Sugo | 2016-06-14 |
| 9334424 | Temporary adhesive for wafer processing, member for wafer processing using the same, wafer processed body, and method for producing thin wafer | Masahito Tanabe, Michihiro Sugo, Hiroyuki Yasuda, Hideto Kato | 2016-05-10 |
| 9263333 | Wafer processing laminate, wafer processing member, temporary adhering material for processing wafer, and manufacturing method of thin wafer | Michihiro Sugo, Hideto Kato, Hiroyuki Yasuda, Masahito Tanabe | 2016-02-16 |
| 9096032 | Wafer processing laminate, wafer processing member, temporary bonding arrangement, and thin wafer manufacturing method | Hideto Kato, Michihiro Sugo, Hiroyuki Yasuda | 2015-08-04 |
| 9063421 | Chemically amplified positive resist composition and pattern forming process | Hiroyuki Yasuda, Katsuya Takemura | 2015-06-23 |
| 8999817 | Wafer process body, wafer processing member, wafer processing temporary adhesive material, and method for manufacturing thin wafer | Michihiro Sugo, Hiroyuki Yasuda, Masahiro Furuya, Hideto Kato | 2015-04-07 |
| 8785585 | Temporary adhesive composition, and method of producing thin wafer | Masahiro Furuya, Hideto Kato, Hideyuki Ito, Masahiro Yoshizawa | 2014-07-22 |
| 8748293 | Organopolysiloxane, temporary adhesive composition containing organopolysiloxane, and method of producing thinned wafer using the same | Masahiro Furuya, Hiroyuki Yasuda, Michihiro Sugo, Hideto Kato | 2014-06-10 |
| 8735264 | Temporary adhesive composition and method for manufacturing thin wafer using the same | Hiroyuki Yasuda, Masahiro Furuya, Michihiro Sugo, Hideyoshi Yanagisawa | 2014-05-27 |