Issued Patents All Time
Showing 1–25 of 78 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12322637 | Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer | Mitsuo Muto, Shohei Tagami | 2025-06-03 |
| 12187989 | Cleaning solution for temporary adhesive for substrates, substrate cleaning method, and cleaning method for support or substrate | Masahito Tanabe, Shohei Tagami | 2025-01-07 |
| 12168759 | Detergent composition, substrate cleaning method, and cleaning method for support or substrate | Masahito Tanabe | 2024-12-17 |
| 12055853 | Photosensitive resin composition, laminate, and pattern forming process | Kumiko Hayashi | 2024-08-06 |
| 11970639 | Temporary adhesive for wafer processing, wafer laminate and method for producing thin wafer | Mitsuo Muto, Shohei Tagami | 2024-04-30 |
| 11460774 | Photosensitive resin composition, photosensitive dry film, and pattern forming process | Yoshinori Hirano, Satoshi Asai, Takahiro Goi | 2022-10-04 |
| 11262655 | Photosensitive resin composition, photosensitive dry film, and pattern forming process | Hitoshi Maruyama, Hideto Kato | 2022-03-01 |
| 11183417 | Method for manufacturing laminate and method for manufacturing substrate | Masahito Tanabe | 2021-11-23 |
| 11069557 | Method for producing thin wafer | Hiroyuki Yasuda | 2021-07-20 |
| 10991611 | Wafer processing laminate and method for processing wafer | Shohei Tagami, Hideto Kato | 2021-04-27 |
| 10982053 | Polymer containing silphenylene and polyether structures | Hitoshi Maruyama, Hideto Kato | 2021-04-20 |
| 10950481 | Method for manufacturing thin substrate | Masahito Tanabe | 2021-03-16 |
| 10854496 | Circuit substrate processing laminate and method for processing circuit substrate | Shohei Tagami | 2020-12-01 |
| 10796939 | Temporary adhesive film roll for substrate processing, method for manufacturing thin wafer | Masahito Tanabe, Kazunori Kondo, Hiroyuki Yasuda | 2020-10-06 |
| 10727103 | Semiconductor device, method for producing the same, and laminate | Hiroyuki Yasuda | 2020-07-28 |
| 10658314 | Wafer laminate, method for production thereof, and adhesive composition for wafer laminate | Hiroyuki Yasuda, Hideto Kato | 2020-05-19 |
| 10553552 | Wafer laminate and method of producing the same | Hiroyuki Yasuda, Hideto Kato | 2020-02-04 |
| 10451970 | Silicone skeleton-containing polymer, photo-curable resin composition, photo-curable dry film, laminate, and patterning process | Hitoshi Maruyama, Kazunori Kondo | 2019-10-22 |
| 10453732 | Wafer laminate and making method | Hiroyuki Yasuda, Hideto Kato | 2019-10-22 |
| 10373903 | Laminate and making method | Hiroyuki Yasuda, Hideto Kato, Kazunori Kondo | 2019-08-06 |
| 10319653 | Semiconductor apparatus, stacked semiconductor apparatus, encapsulated stacked-semiconductor apparatus, and method for manufacturing the same | Katsuya Takemura, Kyoko Soga, Satoshi Asai, Kazunori Kondo, Hideto Kato | 2019-06-11 |
| 10308787 | Resin composition, resin film, method for producing resin film, method for producing semiconductor device, and semiconductor device | Kazunori Kondo, Yoichiro Ichioka | 2019-06-04 |
| 10297485 | Semiconductor device, making method, and laminate | Hiroyuki Yasuda, Hideto Kato, Kazunori Kondo | 2019-05-21 |
| 10242902 | Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer | Hiroyuki Yasuda, Shohei Tagami, Masahito Tanabe | 2019-03-26 |
| 10147632 | Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer | Shohei Tagami, Hiroyuki Yasuda, Masahito Tanabe | 2018-12-04 |