Issued Patents All Time
Showing 26–50 of 78 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10141272 | Semiconductor apparatus, stacked semiconductor apparatus and encapsulated stacked-semiconductor apparatus each having photo-curable resin layer | Katsuya Takemura, Kyoko Soga, Satoshi Asai, Kazunori Kondo, Hideto Kato | 2018-11-27 |
| 10128143 | Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer | Masahito Tanabe, Hiroyuki Yasuda, Shohei Tagami, Hideto Kato | 2018-11-13 |
| 10115622 | Wafer processing laminate and method for processing wafer | Shohei Tagami, Hideto Kato | 2018-10-30 |
| 10106713 | Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer | Shohei Tagami | 2018-10-23 |
| 10074626 | Wafer laminate and making method | Hiroyuki Yasuda | 2018-09-11 |
| 9941145 | Wafer processing temporary bonding arrangement, wafer processing laminate, and thin wafer manufacturing method | Masahito Tanabe, Hiroyuki Yasuda | 2018-04-10 |
| 9934996 | Wafer processing bonding arrangement, wafer laminate, and thin wafer manufacturing method | Hiroyuki Yasuda, Shohei Tagami, Masahito Tanabe | 2018-04-03 |
| 9929068 | Film-like wafer mold material, molded wafer, and semiconductor device | Kazunori Kondo | 2018-03-27 |
| 9884979 | Temporary adhesion method and method for producing thin wafer | Hiroyuki Yasuda, Masahito Tanabe | 2018-02-06 |
| 9887118 | Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer | Shohei Tagami, Masahito Tanabe, Hideto Kato | 2018-02-06 |
| 9796892 | Silicone adhesive composition and solid-state imaging device | Hiroyuki Yasuda, Kyoko Soga | 2017-10-24 |
| 9653335 | Wafer processing laminate, wafer processing member, temporary bonding arrangement, and thin wafer manufacturing method | Hideto Kato, Shohei Tagami | 2017-05-16 |
| 9646868 | Wafer temporary bonding method and thin wafer manufacturing method | Hiroyuki Yasuda, Shohei Tagami, Masahito Tanabe | 2017-05-09 |
| 9550931 | Temporary adhesive material for wafer, film for temporary adhesion using same, wafer processing laminate, and method for producing thin wafer using same | Hiroyuki Yasuda | 2017-01-24 |
| 9472438 | Wafer processing laminate, wafer processing member, temporary adhering material for processing wafer, and manufacturing method of thin wafer | Kazunori Kondo, Hideto Kato, Shohei Tagami, Hiroyuki Yasuda | 2016-10-18 |
| 9458365 | Temporary bonding adhesive compositions and methods of manufacturing a semiconductor device using the same | Tae Hoon Kim, Hideto Kato, Jae-Hyun Kim, Jun-Won Han, Hiroyuki Yasuda +2 more | 2016-10-04 |
| 9365681 | Wafer processing laminate, wafer processing member, temporary bonding arrangement, and thin wafer manufacturing method | Hideto Kato, Shohei Tagami | 2016-06-14 |
| 9346990 | Temporary adhesive material for wafer processing, wafer processing laminate, and method for manufacturing thin wafer using same | Hiroyuki Yasuda | 2016-05-24 |
| 9334424 | Temporary adhesive for wafer processing, member for wafer processing using the same, wafer processed body, and method for producing thin wafer | Masahito Tanabe, Shohei Tagami, Hiroyuki Yasuda, Hideto Kato | 2016-05-10 |
| 9263333 | Wafer processing laminate, wafer processing member, temporary adhering material for processing wafer, and manufacturing method of thin wafer | Hideto Kato, Shohei Tagami, Hiroyuki Yasuda, Masahito Tanabe | 2016-02-16 |
| 9096032 | Wafer processing laminate, wafer processing member, temporary bonding arrangement, and thin wafer manufacturing method | Hideto Kato, Shohei Tagami, Hiroyuki Yasuda | 2015-08-04 |
| 8999817 | Wafer process body, wafer processing member, wafer processing temporary adhesive material, and method for manufacturing thin wafer | Shohei Tagami, Hiroyuki Yasuda, Masahiro Furuya, Hideto Kato | 2015-04-07 |
| 8883913 | Resin composition, resin film, semiconductor device, and production method thereof | Kazunori Kondo | 2014-11-11 |
| 8796410 | Polymer having silphenylene and siloxane structures, a method of preparing the same, an adhesive composition, an adhesive sheet, a protective material for a semiconductor device, and a semiconductor device | Kazunori Kondo | 2014-08-05 |
| 8748293 | Organopolysiloxane, temporary adhesive composition containing organopolysiloxane, and method of producing thinned wafer using the same | Masahiro Furuya, Hiroyuki Yasuda, Shohei Tagami, Hideto Kato | 2014-06-10 |