Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12421435 | Adhesive composition for flexible printed-wiring board (FPC), and heat-curable resin film, prepreg and FPC substrate containing same | Atsushi TSUURA, Yoshihiro TSUTSUMI, Hiroyuki IGUCHI, Yuki Kudo, Masayuki Iwasaki | 2025-09-23 |
| 12110356 | Heat-curable resin composition | Naoyuki KUSHIHARA | 2024-10-08 |
| 12012485 | Heat-curable citraconimide resin composition | Yoshihiro TSUTSUMI, Naoyuki KUSHIHARA | 2024-06-18 |