Issued Patents All Time
Showing 26–31 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6376923 | Flip-chip type semiconductor device sealing material and flip-chip type semiconductor device | Kimitaka Kumagae, Miyuki Wakao, Toshio Shiobara | 2002-04-23 |
| 6372839 | Flip-chip type semiconductor device underfill | Kunio Ito, Toshio Shiobara | 2002-04-16 |
| 6323263 | Semiconductor sealing liquid epoxy resin compositions | Haruyoshi Kuwabawa, Toshio Shiobara | 2001-11-27 |
| 6310120 | Flip-chip type semiconductor device sealing material | Toshio Shiobara | 2001-10-30 |
| 6294271 | Flip-chip type semiconductor device sealing material and flip-chip type semiconductor device | Kimitaka Kumagae, Miyuki Wakao, Toshio Shiobara | 2001-09-25 |
| 6225704 | Flip-chip type semiconductor device | Kimitaka Kumagae, Miyuki Wakao, Toshio Shiobara | 2001-05-01 |