Issued Patents All Time
Showing 101–125 of 187 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6627328 | Light-transmissive epoxy resin composition and semiconductor device | Tatsuya Kanamaru, Tsuyoshi Honda, Eiichi Asano | 2003-09-30 |
| 6569532 | Epoxy resin compositions and premolded semiconductor packages | Kazutoshi Tomiyoshi, Kazuhiro Arai, Koki Oitori, Hironori Sakamoto, Yuji Kishigami +2 more | 2003-05-27 |
| 6558812 | Liquid epoxy resin composition and semiconductor device | Kazuaki Sumita | 2003-05-06 |
| 6534193 | Liquid epoxy resin composition and semiconductor device | Kazuaki Sumita | 2003-03-18 |
| 6518332 | Semiconductor encapsulating epoxy resin compositions, and semiconductor devices encapsulated therewith | Eiichi Asano, Kazutoshi Tomiyoshi, Masachika Yoshino, Shoichi Osada | 2003-02-11 |
| 6512031 | Epoxy resin composition, laminate film using the same, and semiconductor device | Tsuyoshi Honda, Miyuki Wakao | 2003-01-28 |
| 6506822 | Epoxy resin composition | Nobuhiro Ichiroku, Miyuki Wakao | 2003-01-14 |
| 6500564 | Semiconductor encapsulating epoxy resin composition and semiconductor device | Kazuhiro Arai, Hidenori Mizushima, Shigeki Ino, Yasuo Kimura, Takayuki Aoki | 2002-12-31 |
| 6479167 | Sealing material for flip-chip semiconductor device, and flip-chip semiconductor device made therewith | Kazuaki Sumita | 2002-11-12 |
| 6429238 | Flip-chip type semiconductor device sealing material and flip-chip type semiconductor device | Kazuaki Sumita, Kimitaka Kumagae, Miyuki Wakao | 2002-08-06 |
| 6399677 | Epoxy resin compositions and premolded semiconductor packages | Kazutoshi Tomiyoshi, Kazuhiro Arai | 2002-06-04 |
| 6383659 | Epoxy resin composition, laminate film using the same, and semiconductor device | Tsuyoshi Honda, Miyuki Wakao | 2002-05-07 |
| 6376100 | Flip-chip type semiconductor device underfill material and flip-chip type semiconductor device | Kazuaki Sumita | 2002-04-23 |
| 6376923 | Flip-chip type semiconductor device sealing material and flip-chip type semiconductor device | Kazuaki Sumita, Kimitaka Kumagae, Miyuki Wakao | 2002-04-23 |
| 6372839 | Flip-chip type semiconductor device underfill | Kunio Ito, Kazuaki Sumita | 2002-04-16 |
| 6342309 | Epoxy resin composition and semiconductor device | Shigeki Ino, Yasuo Kimura, Takayuki Aoki, Kazuhiro Arai, Hidenori Mizushima | 2002-01-29 |
| 6323263 | Semiconductor sealing liquid epoxy resin compositions | Haruyoshi Kuwabawa, Kazuaki Sumita | 2001-11-27 |
| 6310120 | Flip-chip type semiconductor device sealing material | Kazuaki Sumita | 2001-10-30 |
| 6297306 | Semiconductor encapsulating epoxy resin composition and semiconductor device | Shoichi Osada, Takayuki Aoki, Kazutoshi Tomiyoshi, Eiichi Asano | 2001-10-02 |
| 6294271 | Flip-chip type semiconductor device sealing material and flip-chip type semiconductor device | Kazuaki Sumita, Kimitaka Kumagae, Miyuki Wakao | 2001-09-25 |
| 6291556 | Semiconductor encapsulating epoxy resin composition and semiconductor device | Shoichi Osada, Eiichi Asano, Shigeki Ino, Takayuki Aoki, Kazutoshi Tomiyoshi | 2001-09-18 |
| 6274251 | Semiconductor encapsulating epoxy resin composition and semiconductor device | Kenji Ohashi, Tatsuya Ishizaki, Masayuki Umeno, Eiichi Asano, Kazutoshi Tomiyoshi +1 more | 2001-08-14 |
| 6235865 | Phosphonium borate compound, making method, curing catalyst, and epoxy resin composition | Hisashi Shimizu, Minoru Takei | 2001-05-22 |
| 6231997 | Semiconductor encapsulating epoxy resin compositions, and semiconductor devices | Kazuhiro Arai, Kazutoshi Tomiyoshi | 2001-05-15 |
| 6225704 | Flip-chip type semiconductor device | Kazuaki Sumita, Kimitaka Kumagae, Miyuki Wakao | 2001-05-01 |