Issued Patents All Time
Showing 151–175 of 187 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5362887 | Fluorine - modified acid anhydrides | Koji Futatsumori, Kazuhiro Arai, Hisashi Shimizu, Shigeki Ino | 1994-11-08 |
| 5362775 | Epoxy resin composition and cured product thereof | Akira Shintai, Hiroshi Shibata, Koji Futatsumori, Seizi Katayama, Yasutaka Yoshida | 1994-11-08 |
| 5358980 | Naphthol novolac epoxy resin compositions and semiconductor devices encapsulated therewith | Kazutoshi Tomiyoshi | 1994-10-25 |
| 5340851 | Thermosetting resin compositions | Hisashi Shimizu, Minoru Takei | 1994-08-23 |
| 5336786 | Organic silicon compounds | Koji Futatsumori, Satoshi Okuse, Takayuki Aoki, Miyuki Wakao, Shigeki Ino | 1994-08-09 |
| 5326589 | Method of protecting electronic or electric part | Hiroshige Okinoshima, Tsutomu Kashiwagi | 1994-07-05 |
| 5312878 | Naphthalene containing epoxy resin cured with a dicyclopentadiene phenolic resin | Kazutoshi Tomiyoshi, Takayuki Aoki, Hatsuji Shiraishi | 1994-05-17 |
| 5306748 | Fluorine-modified thermosetting resin and thermosetting resin composition | Hisashi Shimizu, Manabu Narumi | 1994-04-26 |
| 5300588 | Thermosetting resin compositions | Kazutoshi Tomiyoshi, Hisashi Shimizu, Manabu Marumi | 1994-04-05 |
| 5298548 | Epoxy resin composition and semiconductor devices encapsulated therewith | Takayuki Aoki, Kazutoshi Tomiyoshi, Hisashi Shimizu, Takashi Tsuchiya | 1994-03-29 |
| 5290882 | Thermosetting resin compositions | Hisashi Shimizu, Manabu Narumi | 1994-03-01 |
| 5256720 | Polypropylene resin composition | Satoshi Kuwata | 1993-10-26 |
| 5250637 | Semiconductor encapsulating epoxy resin compositions and semiconductor devices | Kazutoshi Tomiyoshi, Yasuo Tarumi, Hiromasa Yamaguchi | 1993-10-05 |
| 5248710 | Flip chip encapsulating compositions and semiconductor devices encapsulated therewith | Koji Futatsumori, Shinichi Jingu | 1993-09-28 |
| 5243058 | Allyl or propenyl group-containing naphthalene derivatives | Kazutoshi Tomiyoshi, Hisashi Shimizu, Manabu Narumi | 1993-09-07 |
| 5235005 | Polyimide resin composition and semiconductor device encapsulated therewith | Koji Futatsumori, Shinichi Jingu | 1993-08-10 |
| 5225484 | Epoxy resin compositions and cured products thereof | Takayuki Aoki, Kazutoshi Tomiyoshi, Takashi Tsuchiya | 1993-07-06 |
| 5198479 | Light transmissive epoxy resin compositions and optical semiconductor devices encapsulated therewith | Koji Futatsumori, Kazuhiro Arai | 1993-03-30 |
| 5190995 | Naphthalene ring containing epoxy resin composition and semiconductor device encapsulated therewith | Kazutoshi Tomiyoshi | 1993-03-02 |
| 5182351 | Thermosetting resin compositions | Hisashi Shimizu | 1993-01-26 |
| 5179176 | Propenyl group-containing epoxy resin | Hisashi Shimizu, Takayuki Aoki | 1993-01-12 |
| 5175199 | High transparency silica-titania glass beads, method for making, and light transmission epoxy resin compositions | Eiichi Asano, Takaaki Shimizu, Masatoshi Takita, Koji Futatsumori, Kazuhiro Arai | 1992-12-29 |
| 5173544 | Epoxy resin compositions | Hisashi Shimizu, Kazutoshi Tomiyoshi, Hatsuji Shiraishi | 1992-12-22 |
| 5171869 | Allyl or propenyl group-containing naphthalene derivatives | Kazutoshi Tomiyoshi, Hisashi Shimizu, Manabu Narumi | 1992-12-15 |
| 5166228 | Epoxy resin compositions containing polysubstituted novolac epoxy resins and naphthylene based phenolic resin curing agents and semiconductor devices encapsulated therewith | Kazutoshi Tomiyoshi, Koji Futatsumori, Takashi Tsuchiya, Takayuki Aoki | 1992-11-24 |