Issued Patents All Time
Showing 26–50 of 80 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11562962 | Package comprising a substrate and interconnect device configured for diagonal routing | Joan Rey Villarba BUOT, Aniket PATIL, Zhijie Wang | 2023-01-24 |
| 11552015 | Substrate comprising a high-density interconnect portion embedded in a core layer | Aniket PATIL, Kuiwon Kang | 2023-01-10 |
| 11551939 | Substrate comprising interconnects embedded in a solder resist layer | Kun Fang, Jaehyun Yeon, Suhyung Hwang | 2023-01-10 |
| 11545435 | Double sided embedded trace substrate | Kuiwon Kang, Zhijie Wang | 2023-01-03 |
| 11545439 | Package comprising an integrated device coupled to a substrate through a cavity | Aniket PATIL, Kuiwon Kang | 2023-01-03 |
| 11545425 | Substrate comprising interconnects embedded in a solder resist layer | Kun Fang, Jaehyun Yeon, Suhyung Hwang | 2023-01-03 |
| 11502049 | Package comprising multi-level vertically stacked redistribution portions | Aniket PATIL, David Fraser Rae | 2022-11-15 |
| 11456291 | Integrated circuit (IC) packages employing split, double-sided metallization structures to facilitate a semiconductor die (“die”) module employing stacked dice, and related fabrication methods | Marcus HSU, Aniket PATIL | 2022-09-27 |
| 11444019 | Package comprising a substrate with interconnect routing over solder resist layer and an integrated device coupled to the substrate and method for manufacturing the package | Aniket PATIL, Kuiwon Kang | 2022-09-13 |
| 11393808 | Ultra-low profile stacked RDL semiconductor package | Aniket PATIL, David Fraser Rae | 2022-07-19 |
| 11342246 | Multi-terminal integrated passive devices embedded on die and a method for fabricating the multi-terminal integrated passive devices | Aniket PATIL, Jonghae Kim | 2022-05-24 |
| 11302656 | Passive device orientation in core for improved power delivery in package | Aniket PATIL, Joan Rey Villarba BUOT, Zhijie Wang | 2022-04-12 |
| 11296022 | Package and substrate comprising interconnects with semi-circular planar shape and/or trapezoid planar shape | Aniket PATIL, Joan Rey Villarba BUOT | 2022-04-05 |
| 11296024 | Nested interconnect structure in concentric arrangement for improved package architecture | Aniket PATIL, Jonghae Kim | 2022-04-05 |
| 11289453 | Package comprising a substrate and a high-density interconnect structure coupled to the substrate | Aniket PATIL, Zhijie Wang | 2022-03-29 |
| 11258165 | Asymmetric antenna structure | Chin-Kwan Kim, Jaehyun Yeon, Suhyung Hwang | 2022-02-22 |
| 11183446 | X.5 layer substrate | Jaehyun Yeon, Suhyung Hwang, Kun Fang | 2021-11-23 |
| 11177223 | Electromagnetic interference shielding for packages and modules | Aniket PATIL, Brigham NAVAJA | 2021-11-16 |
| 11101220 | Through-package partial via on package edge | Aniket PATIL, Jaehyun Yeon | 2021-08-24 |
| 11075260 | Substrate comprising recessed interconnects and a surface mounted passive component | Kuiwon Kang, Chin-Kwan Kim, Jaehyun Yeon | 2021-07-27 |
| 11043740 | Enhanced antenna module with shield layer | Suhyung Hwang, Chin-Kwan Kim, Jaehyun Yeon | 2021-06-22 |
| 10879158 | Split conductive pad for device terminal | Aniket PATIL, Kuiwon Kang, Zhijie Wang | 2020-12-29 |
| 10516092 | Interface substrate and method of making the same | Jon Aday, Steve Joseph Bezuk, Nicholas Ian Buchan | 2019-12-24 |
| 10490472 | Air cavity mold | Jie Fu, Manuel Aldrete | 2019-11-26 |
| 10410971 | Thermal and electromagnetic interference shielding for die embedded in package substrate | David Fraser Rae, Christopher J. Healy, Chin-Kwan Kim | 2019-09-10 |