Issued Patents All Time
Showing 51–75 of 80 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10403707 | Array type inductor | Chin-Kwan Kim, Joonsuk Park | 2019-09-03 |
| 10181410 | Integrated circuit package comprising surface capacitor and ground plane | Young Kyu Song, Kyu-Pyung Hwang | 2019-01-15 |
| 10157823 | High density fan out package structure | Dong Wook Kim, Jae Sik Lee, Shiqun Gu | 2018-12-18 |
| 10079097 | Capacitor structure for power delivery applications | Young Kyu Song, Kyu-Pyung Hwang | 2018-09-18 |
| 10049977 | Semiconductor package on package structure and method of forming the same | Dong Wook Kim, Jae Sik Lee, Kyu-Pyung Hwang, Young Kyu Song | 2018-08-14 |
| 9881859 | Substrate block for PoP package | Dong Wook Kim, Jae Sik Lee, Shiqun Gu, Ratibor Radojcic | 2018-01-30 |
| 9875997 | Low profile reinforced package-on-package semiconductor device | Dong Wook Kim, Kyu-Pyung Hwang, Young Kyu Song | 2018-01-23 |
| 9799628 | Stacked package configurations and methods of making the same | Dong Wook Kim, Jae Sik Lee, Shiqun Gu | 2017-10-24 |
| 9679855 | Polymer crack stop seal ring structure in wafer level package | Jae Sik Lee, Dong Wook Kim, Jon Aday | 2017-06-13 |
| 9659850 | Package substrate comprising capacitor, redistribution layer and discrete coaxial connection | Kyu-Pyung Hwang, Young Kyu Song, Dong Wook Kim | 2017-05-23 |
| 9642259 | Embedded bridge structure in a substrate | Chin-Kwan Kim, Omar J. Bchir, Dong Wook Kim | 2017-05-02 |
| 9633950 | Integrated device comprising flexible connector between integrated circuit (IC) packages | Jae Sik Lee, Dong Wook Kim | 2017-04-25 |
| 9633977 | Integrated device comprising flexible connector between integrated circuit (IC) packages | Shiqun Gu, Urmi Ray, Ratibor Radojcic | 2017-04-25 |
| 9628052 | Embedded multi-terminal capacitor | Dong Wook Kim, Kyu-Pyung Hwang, Young Kyu Song | 2017-04-18 |
| 9613942 | Interposer for a package-on-package structure | Jae Sik Lee, Kyu-Pyung Hwang | 2017-04-04 |
| 9595494 | Semiconductor package with high density die to die connection and method of making the same | Dong Wook Kim, Jae Sik Lee | 2017-03-14 |
| 9596768 | Substrate with conductive vias | Dong Wook Kim, Jae Sik Lee, Shiqun Gu | 2017-03-14 |
| 9595496 | Integrated device package comprising silicon bridge in an encapsulation layer | Jae Sik Lee, Dong Wook Kim, Shiqun Gu | 2017-03-14 |
| 9583462 | Damascene re-distribution layer (RDL) in fan out split die application | Jae Sik Lee, Dong Wook Kim | 2017-02-28 |
| 9583433 | Integrated device package comprising conductive sheet configured as an inductor in an encapsulation layer | Young Kyu Song, Kyu-Pyung Hwang | 2017-02-28 |
| 9502490 | Embedded package substrate capacitor | Kyu-Pyung Hwang, Young Kyu Song, Dong Wook Kim | 2016-11-22 |
| 9490226 | Integrated device comprising a heat-dissipation layer providing an electrical path for a ground signal | Young Kyu Song, Dong Wook Kim, Kyu-Pyung Hwang | 2016-11-08 |
| 9466554 | Integrated device comprising via with side barrier layer traversing encapsulation layer | Jae Sik Lee, Dong Wook Kim, Shiqun Gu | 2016-10-11 |
| 9443824 | Cavity bridge connection for die split architecture | Jae Sik Lee, Dong Wook Kim | 2016-09-13 |
| 9401350 | Package-on-package (POP) structure including multiple dies | Jae Sik Lee, Dong Wook Kim, Shiqun Gu | 2016-07-26 |