Issued Patents All Time
Showing 26–48 of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9988733 | Apparatus and method for modulating azimuthal uniformity in electroplating | Gabriel Hay Graham, Lee Peng Chua, Steven T. Mayer, Aaron Berke | 2018-06-05 |
| 9834852 | Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating | Steven T. Mayer, Bryan L. Buckalew, Haiying Fu, Thomas A. Ponnuswamy, Hilton Diaz Camilo +1 more | 2017-12-05 |
| 9828688 | Methods and apparatus for wetting pretreatment for through resist metal plating | Bryan L. Buckalew, Steven T. Mayer, Thomas A. Ponnuswamy, Brian Paul Blackman, Doug Higley | 2017-11-28 |
| 9752248 | Methods and apparatuses for dynamically tunable wafer-edge electroplating | Burhanuddin Kagajwala, Bryan L. Buckalew, Aaron Berke, James Isaac Fortner | 2017-09-05 |
| 9721800 | Apparatus for wetting pretreatment for enhanced damascene metal filling | Steven T. Mayer, David W. Porter, Mark J. Willey | 2017-08-01 |
| 9624592 | Cross flow manifold for electroplating apparatus | Richard Abraham, Steven T. Mayer, Bryan L. Buckalew | 2017-04-18 |
| 9617652 | Bubble and foam solutions using a completely immersed air-free feedback flow control valve | Richard Abraham, David W. Porter, Steven T. Mayer, John Floyd Ostrowski | 2017-04-11 |
| 9567685 | Apparatus and method for dynamic control of plated uniformity with the use of remote electric current | Burhanuddin Kagajwala, Bryan L. Buckalew, Steven T. Mayer, Lee Peng Chua, Aaron Berke +1 more | 2017-02-14 |
| 9523155 | Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating | Steven T. Mayer, Bryan L. Buckalew, Haiying Fu, Thomas A. Ponnuswamy, Hilton Diaz Camilo +1 more | 2016-12-20 |
| 9455139 | Methods and apparatus for wetting pretreatment for through resist metal plating | Bryan L. Buckalew, Steven T. Mayer, Thomas A. Ponnuswamy, Brian Paul Blackman, Doug Higley | 2016-09-27 |
| 9394620 | Control of electrolyte hydrodynamics for efficient mass transfer during electroplating | Steven T. Mayer, David W. Porter, Edwin Goh, Bryan L. Buckalew | 2016-07-19 |
| 9260793 | Electroplating apparatus for tailored uniformity profile | Steven T. Mayer, David W. Porter, Bryan L. Buckalew | 2016-02-16 |
| 9221081 | Automated cleaning of wafer plating assembly | Steven T. Mayer, Thomas A. Ponnuswamy, Lee Peng Chua | 2015-12-29 |
| 9139927 | Electrolyte loop with pressure regulation for separated anode chamber of electroplating system | Richard Abraham, David W. Porter, Steven T. Mayer | 2015-09-22 |
| 8858774 | Electroplating apparatus for tailored uniformity profile | Steven T. Mayer, David W. Porter, Bryan L. Buckalew | 2014-10-14 |
| 8603305 | Electrolyte loop with pressure regulation for separated anode chamber of electroplating system | Richard Abraham, David W. Porter, Steven T. Mayer | 2013-12-10 |
| 8475637 | Electroplating apparatus with vented electrolyte manifold | Jingbin Feng, Zhian He, Steven T. Mayer | 2013-07-02 |
| 8398831 | Rapidly cleanable electroplating cup seal | Shantinath Ghongadi, Jeff Hawkins, Seshasayee Varadarajan, Tariq Majid, Kousik Ganesan +2 more | 2013-03-19 |
| 8377268 | Electroplating cup assembly | Shantinath Ghongadi, Kousik Ganesan, Zhian He, Tariq Majid, Jeff Hawkins +2 more | 2013-02-19 |
| 8172992 | Wafer electroplating apparatus for reducing edge defects | Vinay Prabhakar, Bryan L. Buckalew, Kousik Ganesan, Shantinath Ghongadi, Zhian He +4 more | 2012-05-08 |
| D648289 | Electroplating flow shaping plate having offset spiral hole pattern | Steven T. Mayer, David W. Porter | 2011-11-08 |
| 7985325 | Closed contact electroplating cup assembly | Shantinath Ghongadi, Kousik Ganesan, Zhian He, Tariq Majid, Jeff Hawkins +2 more | 2011-07-26 |
| 7935231 | Rapidly cleanable electroplating cup assembly | Shantinath Ghongadi, Jeff Hawkins, Seshasayee Varadarajan, Tariq Majid, Kousik Ganesan +2 more | 2011-05-03 |