Issued Patents All Time
Showing 1,351–1,375 of 1,397 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5335138 | High dielectric constant capacitor and method of manufacture | Pierre C. Fazan | 1994-08-02 |
| 5332689 | Method for depositing low bulk resistivity doped films | Charles L. Turner | 1994-07-26 |
| 5320880 | Method of providing a silicon film having a roughened outer surface | Trung T. Doan | 1994-06-14 |
| 5318927 | Methods of chemical-mechanical polishing insulating inorganic metal oxide materials | Donald L. Westmoreland, Trung T. Doan | 1994-06-07 |
| 5300155 | IC chemical mechanical planarization process incorporating slurry temperature control | Chris C. Yu | 1994-04-05 |
| 5298463 | Method of processing a semiconductor wafer using a contact etch stop | David A. Cathey | 1994-03-29 |
| 5278100 | Chemical vapor deposition technique for depositing titanium silicide on semiconductor wafers | Trung T. Doan | 1994-01-11 |
| 5271798 | Method for selective removal of a material from a wafer's alignment marks | Alan Laulusa | 1993-12-21 |
| 5264396 | Method for enhancing nitridation and oxidation growth by introducing pulsed NF.sub.3 | Randhir P. S. Thakur, Richard C. Hawthorne, Annette L. Martin | 1993-11-23 |
| 5258096 | Method of forming local etch stop landing pads for simultaneous, self-aligned dry etching of contact vias with various depths | Donwon Park, Tyler Lowrey | 1993-11-02 |
| 5258637 | Semiconductor devices produced according to a method which reduces contact resistance at silicide/active area interfaces | Mohammed Anjum | 1993-11-02 |
| 5254499 | Method of depositing high density titanium nitride films on semiconductor wafers | Trung T. Doan, Scott Meikle | 1993-10-19 |
| 5252518 | Method for forming a mixed phase TiN/TiSi film for semiconductor manufacture using metal organometallic precursors and organic silane | Trung T. Doan | 1993-10-12 |
| 5246881 | Low-pressure chemical vapor deposition process for depositing high-density, highly-conformal, titanium nitride films of low bulk resistivity | Todd W. Buley | 1993-09-21 |
| 5240739 | Chemical vapor deposition technique for depositing titanium silicide on semiconductor wafers | Trung T. Doan | 1993-08-31 |
| 5240552 | Chemical mechanical planarization (CMP) of a semiconductor wafer using acoustical waves for in-situ end point detection | Chris C. Yu | 1993-08-31 |
| 5236860 | Lateral extension stacked capacitor | Pierre C. Fazan, Hiang C. Chan, Yauh-Ching Liu | 1993-08-17 |
| 5235312 | Polysilicon resistors and methods of fabrication | Pierre C. Fazan | 1993-08-10 |
| 5234855 | Stacked comb spacer capacitor | Howard E. Rhodes, Hiang C. Chan, Charles H. Dennison, Yauh-Ching Liu, Pierre C. Fazan | 1993-08-10 |
| 5232875 | Method and apparatus for improving planarity of chemical-mechanical planarization operations | Mark E. Tuttle, Trung T. Doan, Angus C. Fox, III, Hugh E. Stroupe | 1993-08-03 |
| 5231056 | Tungsten silicide (WSi.sub.x) deposition process for semiconductor manufacture | — | 1993-07-27 |
| 5227334 | LPCVD process for depositing titanium nitride (tin) films and silicon substrates produced thereby | — | 1993-07-13 |
| 5223734 | Semiconductor gettering process using backside chemical mechanical planarization (CMP) and dopant diffusion | Tyler Lowrey, Trung T. Doan | 1993-06-29 |
| 5212111 | Local-oxidation of silicon (LOCOS) process using ceramic barrier layer | Trung T. Doan | 1993-05-18 |
| 5206187 | Method of processing semiconductor wafers using a contact etch stop | Trung T. Doan | 1993-04-27 |