| 8053371 |
Apparatus and methods for selective removal of material from wafer alignment marks |
Russell C. Zahorik, Guy F. Hudson, Todd A. Dobson, Brian F. Gordon |
2011-11-08 |
$3,716,000 |
| 7449368 |
Technique for attaching die to leads |
— |
2008-11-11 |
$1,653,000 |
| 7307353 |
Technique for attaching die to leads |
— |
2007-12-11 |
$2,442,000 |
| 7244681 |
Methods for selective removal of material from wafer alignment marks |
Guy F. Hudson, Todd A. Dobson, Brian F. Gordon, Russell C. Zahorik |
2007-07-17 |
$2,723,000 |
| 7135763 |
Technique for attaching die to leads |
— |
2006-11-14 |
$3,511,000 |
| 6889698 |
Apparatus for selective removal of material from wafer alignment marks |
Russell C. Zahorik, Guy F. Hudson, Todd A. Dobson, Brian F. Gordon |
2005-05-10 |
$1,150,000 |
| 6882032 |
Technique for attaching die to leads |
— |
2005-04-19 |
$902,000 |
| 6828227 |
Method for applying uniform pressurized film across wafer |
Guy T. Blalock, Lynn J. Carroll |
2004-12-07 |
$1,817,000 |
| 6693034 |
Deadhesion method and mechanism for wafer processing |
Guy T. Blalock, Brian F. Gordon |
2004-02-17 |
$2,708,000 |
| 6656402 |
Wafer planarization using a uniform layer of material and method for forming uniform layer of material used in semiconductor processing |
Guy T. Blalock, Brian F. Gordon |
2003-12-02 |
$2,846,000 |
| 6653722 |
Method for applying uniform pressurized film across wafer |
Guy T. Blalock, Lynn J. Carroll |
2003-11-25 |
$2,006,000 |
| 6645345 |
Wafer planarization using a uniform layer of material and method and apparatus for forming uniform layer of material used in semiconductor processing |
Guy T. Blalock, Brian F. Gordon |
2003-11-11 |
$2,657,000 |
| 6624089 |
Wafer planarization using a uniform layer of material and method and apparatus for forming uniform layer of material used in semiconductor processing |
Guy T. Blalock, Brian F. Gordon |
2003-09-23 |
$3,145,000 |
| 6610610 |
Methods for selective removal of material from wafer alignment marks |
Russell C. Zahorik, Guy F. Hudson, Todd A. Dobson, Brian F. Gordon |
2003-08-26 |
$4,256,000 |
| 6555897 |
Assembly for attaching die to leads |
— |
2003-04-29 |
$2,096,000 |
| 6530113 |
Apparatus for selective removal of material from wafer alignment marks |
Russell C. Zahorik, Guy F. Hudson, Todd A. Dobson, Brian F. Gordon |
2003-03-11 |
$2,273,000 |
| 6518172 |
Method for applying uniform pressurized film across wafer |
Guy T. Blalock, Lynn J. Carroll |
2003-02-11 |
$1,748,000 |
| 6506679 |
Deadhesion method and mechanism for wafer processing |
Guy T. Blalock, Brian F. Gordon |
2003-01-14 |
$3,226,000 |
| 6472725 |
Technique for attaching die to leads |
— |
2002-10-29 |
$3,828,000 |
| 6429146 |
Wafer planarization using a uniform layer of material and method and apparatus for forming uniform layer of material used in semiconductor processing |
Guy T. Blalock, Brian F. Gordon |
2002-08-06 |
$3,513,000 |
| 6410459 |
Wafer planarization using a uniform layer of material and method and apparatus for forming uniform layer of material used in semiconductor processing |
Guy T. Blalock, Brian F. Gordon |
2002-06-25 |
$4,927,000 |
| 6380086 |
High-speed planarizing apparatus for chemical-mechanical planarization of semiconductor wafers |
Karl M. Robinson |
2002-04-30 |
$4,819,000 |
| 6329301 |
Method and apparatus for selective removal of material from wafer alignment marks |
Russell C. Zahorik, Guy F. Hudson, Todd A. Dobson, Brian F. Gordon |
2001-12-11 |
$7,768,000 |
| 6316363 |
Deadhesion method and mechanism for wafer processing |
Guy T. Blalock, Brian F. Gordon |
2001-11-13 |
$9,194,000 |
| 6309913 |
Technique for attaching die to leads |
— |
2001-10-30 |
$9,423,000 |
