{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Deadhesion method and mechanism for wafer processing", "item": "https://www.patentleaderboard.com/patent/6506679"}]}
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Home › Deadhesion method and mechanism for wafer processing

Deadhesion method and mechanism for wafer processing

US Patent 6506679 · Granted Jan 14, 2003

Estimated economic value: $3,226,000 ⓘ

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