Issued Patents All Time
Showing 25 most recent of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8053371 | Apparatus and methods for selective removal of material from wafer alignment marks | Russell C. Zahorik, Guy F. Hudson, Hugh E. Stroupe, Todd A. Dobson | 2011-11-08 |
| 7244681 | Methods for selective removal of material from wafer alignment marks | Guy F. Hudson, Hugh E. Stroupe, Todd A. Dobson, Russell C. Zahorik | 2007-07-17 |
| 7093704 | Printed circuit board support | Tony Teitenberg, John S. Godfrey | 2006-08-22 |
| 6971499 | Printed circuit board support | Tony Teitenberg, John S. Godfrey | 2005-12-06 |
| 6962248 | Printed circuit board support | Tony Teitenberg, John S. Godfrey | 2005-11-08 |
| 6898838 | Inflatable bladder with suction for supporting circuit board assembly processing | — | 2005-05-31 |
| 6889698 | Apparatus for selective removal of material from wafer alignment marks | Russell C. Zahorik, Guy F. Hudson, Hugh E. Stroupe, Todd A. Dobson | 2005-05-10 |
| 6863170 | Printed circuit board support | Tony Teitenberg, John S. Godfrey | 2005-03-08 |
| 6863169 | Printed circuit board support | Tony Teitenberg, John S. Godfrey | 2005-03-08 |
| 6857627 | Inflatable bladder with suction for supporting circuit board assembly processing | — | 2005-02-22 |
| 6749054 | Printed circuit board support | Tony Teitenberg, John S. Godfrey | 2004-06-15 |
| 6693034 | Deadhesion method and mechanism for wafer processing | Guy T. Blalock, Hugh E. Stroupe | 2004-02-17 |
| 6656402 | Wafer planarization using a uniform layer of material and method for forming uniform layer of material used in semiconductor processing | Guy T. Blalock, Hugh E. Stroupe | 2003-12-02 |
| 6645345 | Wafer planarization using a uniform layer of material and method and apparatus for forming uniform layer of material used in semiconductor processing | Guy T. Blalock, Hugh E. Stroupe | 2003-11-11 |
| 6631798 | Printed circuit board support | Tony Teitenberg, John S. Godfrey | 2003-10-14 |
| 6624089 | Wafer planarization using a uniform layer of material and method and apparatus for forming uniform layer of material used in semiconductor processing | Guy T. Blalock, Hugh E. Stroupe | 2003-09-23 |
| 6610610 | Methods for selective removal of material from wafer alignment marks | Russell C. Zahorik, Guy F. Hudson, Hugh E. Stroupe, Todd A. Dobson | 2003-08-26 |
| 6569241 | Substrate spinning apparatus | Paul D. Shirley | 2003-05-27 |
| 6555276 | Substrate coating and semiconductor processing method of improving uniformity of liquid deposition | Paul D. Shirley | 2003-04-29 |
| 6530113 | Apparatus for selective removal of material from wafer alignment marks | Russell C. Zahorik, Guy F. Hudson, Hugh E. Stroupe, Todd A. Dobson | 2003-03-11 |
| 6506679 | Deadhesion method and mechanism for wafer processing | Guy T. Blalock, Hugh E. Stroupe | 2003-01-14 |
| 6447634 | Method and apparatus for selective removal of material from wafer alignment marks | Russell C. Zahorik, Guy F. Hudson, Hugh Stroupe, Todd A. Dobson | 2002-09-10 |
| 6429146 | Wafer planarization using a uniform layer of material and method and apparatus for forming uniform layer of material used in semiconductor processing | Guy T. Blalock, Hugh E. Stroupe | 2002-08-06 |
| 6410459 | Wafer planarization using a uniform layer of material and method and apparatus for forming uniform layer of material used in semiconductor processing | Guy T. Blalock, Hugh E. Stroupe | 2002-06-25 |
| 6398868 | Substrate coating apparatus | Paul D. Shirley | 2002-06-04 |