Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Deadhesion method and mechanism for wafer processing

Deadhesion method and mechanism for wafer processing

US Patent 6693034 · Granted Feb 17, 2004

Estimated economic value: $2,708,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Resonator for thermo optic device2015
Dielectric structures2013
Resonator for thermo optic device2012
Atomic layer deposition methods2012
Method and apparatus for surface tension control in advanced photolithography2012
Waveguide for thermo optic device2012
Stud capacitor device and fabrication method2012
Apparatus and methods for selective removal of material from wafer alignment mar2011
Apparatus and methods for selective removal of material from wafer alignment mar2011
Method for removing metal layers formed outside an aperture of a BPSG layer util2011
Atomic layer deposition methods2011
Waveguide for thermo optic device2011