Issued Patents All Time
Showing 1,301–1,325 of 1,397 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5731235 | Methods of forming a silicon nitrite film, a capacitor dielectric layer and a capacitor | Anand Srinivasan, Sujit Sharan | 1998-03-24 |
| 5730642 | System for real-time control of semiconductor wafer polishing including optical montoring | Trung T. Doan | 1998-03-24 |
| 5723382 | Method of making a low-resistance contact to silicon having a titanium silicide interface, an amorphous titanium nitride barrier layer and a conductive plug | Trung T. Doan, Tyler Lowrey | 1998-03-03 |
| 5719991 | System for compensating against wafer edge heat loss in rapid thermal processing | Randhir P. S. Thakur | 1998-02-17 |
| 5700180 | System for real-time control of semiconductor wafer polishing | Trung T. Doan | 1997-12-23 |
| 5691009 | Method of reducing carbon incorporation into films produced by chemical vapor deposition involving organic precursor compounds | — | 1997-11-25 |
| 5686748 | Dielectric material and process to create same | Randhir P. S. Thakur | 1997-11-11 |
| 5681423 | Semiconductor wafer for improved chemical-mechanical polishing over large area features | Chris C. Yu | 1997-10-28 |
| 5665644 | Semiconductor processing method of forming electrically conductive interconnect lines and integrated circuitry | Ravi Iyer | 1997-09-09 |
| 5664988 | Process of polishing a semiconductor wafer having an orientation edge discontinuity shape | Hugh E. Stroupe, Sujit Sharan | 1997-09-09 |
| 5665611 | Method of forming a thin film transistor using fluorine passivation | Shubneesh Batra, Pierre C. Fazan | 1997-09-09 |
| 5665625 | Method of forming capacitors having an amorphous electrically conductive layer | Kris K. Brown | 1997-09-09 |
| 5663797 | Method and apparatus for detecting the endpoint in chemical-mechanical polishing of semiconductor wafers | — | 1997-09-02 |
| 5663088 | Method of forming a Ta.sub.2 O.sub.5 dielectric layer with amorphous diffusion barrier layer and method of forming a capacitor having a Ta.sub.2 O.sub.5 dielectric layer and amorphous diffusion barrier layer | Pierre C. Fazan | 1997-09-02 |
| 5661115 | Method of reducing carbon incorporation into films produced by chemical vapor deposition involving organic precursor compounds | — | 1997-08-26 |
| 5658391 | Method of chamber cleaning in MOCVD application | Todd W. Buley | 1997-08-19 |
| 5658183 | System for real-time control of semiconductor wafer polishing including optical monitoring | Trung T. Doan | 1997-08-19 |
| 5654222 | Method for forming a capacitor with electrically interconnected construction | Paul J. Schuele, Wayne Kinney | 1997-08-05 |
| 5643060 | System for real-time control of semiconductor wafer polishing including heater | Trung T. Doan | 1997-07-01 |
| 5641545 | Method to deposit highly conformal CVD films | — | 1997-06-24 |
| 5618447 | Polishing pad counter meter and method for real-time control of the polishing rate in chemical-mechanical polishing of semiconductor wafers | — | 1997-04-08 |
| 5599396 | High density inductively and capacitively coupled plasma chamber | — | 1997-02-04 |
| 5576071 | Method of reducing carbon incorporation into films produced by chemical vapor deposition involving organic precursor compounds | — | 1996-11-19 |
| 5571572 | Method of depositing titanium carbonitride films on semiconductor wafers | — | 1996-11-05 |
| 5540810 | IC mechanical planarization process incorporating two slurry compositions for faster material removal times | Richard L. Elliott, Trung T. Doan, Jody D. Larsen | 1996-07-30 |