Issued Patents All Time
Showing 1,326–1,350 of 1,397 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5533924 | Polishing apparatus, a polishing wafer carrier apparatus, a replacable component for a particular polishing apparatus and a process of polishing wafers | Hugh E. Stroupe, Sujit Sharan | 1996-07-09 |
| 5523261 | Method of cleaning high density inductively coupled plasma chamber using capacitive coupling | — | 1996-06-04 |
| 5506166 | Method for forming capacitor compatible with high dielectric constant materials having a low contact resistance layer | Pierre C. Fazan | 1996-04-09 |
| 5504831 | System for compensating against wafer edge heat loss in rapid thermal processing | Randhir P. S. Thakur | 1996-04-02 |
| 5496762 | Highly resistive structures for integrated circuits and method of manufacturing the same | Trung T. Doan, David A. Cathey | 1996-03-05 |
| 5486129 | System and method for real-time control of semiconductor a wafer polishing, and a polishing head | Trung T. Doan | 1996-01-23 |
| 5480684 | Method of reducing carbon incorporation into films produced by chemical vapor deposition involving organometallic precursor compounds | — | 1996-01-02 |
| 5464031 | Method of chamber cleaning in MOCVD applications | Todd W. Buley | 1995-11-07 |
| 5438019 | Large area thin film growing method | — | 1995-08-01 |
| 5433794 | Spacers used to form isolation trenches with improved corners | Pierre C. Fazan, Martin C. Roberts | 1995-07-18 |
| 5409587 | Sputtering with collinator cleaning within the sputtering chamber | Sung-Cheol Kim, David J. Kubista | 1995-04-25 |
| 5399379 | Low-pressure chemical vapor deposition process for depositing high-density, highly-conformal titanium nitride films of low bulk resistivity | — | 1995-03-21 |
| 5393564 | High efficiency method for performing a chemical vapor deposition utilizing a nonvolatile precursor | Donald L. Westmoreland | 1995-02-28 |
| 5392189 | Capacitor compatible with high dielectric constant materials having two independent insulative layers and the method for forming same | Pierre C. Fazan | 1995-02-21 |
| 5387315 | Process for deposition and etching of copper in multi-layer structures | — | 1995-02-07 |
| 5381302 | Capacitor compatible with high dielectric constant materials having a low contact resistance layer and the method for forming same | Pierre C. Fazan | 1995-01-10 |
| 5377429 | Method and appartus for subliming precursors | Scott Meikle, Donald L. Westmoreland | 1995-01-03 |
| 5376593 | Method for fabricating stacked layer Si.sub.3 N.sub.4 for low leakage high capacitance films using rapid thermal nitridation | Randhir P. S. Thakur | 1994-12-27 |
| 5376405 | Chemical vapor deposition technique for depositing titanium silicide on semiconductor wafers | Trung T. Doan | 1994-12-27 |
| 5368687 | Semiconductor processing method of etching insulating inorganic metal oxide materials and method of cleaning metals from the surface of semiconductor wafers | Donald L. Westmoreland, Pierre C. Fazan | 1994-11-29 |
| 5364187 | System for repeatable temperature measurement using surface reflectivity | Randhir P. S. Thakur, Annette L. Martin | 1994-11-15 |
| 5358894 | Oxidation enhancement in narrow masked field regions of a semiconductor wafer | Pierre C. Fazan, Viju K. Mathews, Mohammed Anjum, Hiang C. Chan | 1994-10-25 |
| 5350236 | Method for repeatable temperature measurement using surface reflectivity | Randhir P. S. Thakur, Annette L. Martin | 1994-09-27 |
| 5344792 | Pulsed plasma enhanced CVD of metal silicide conductive films such as TiSi.sub.2 | Trung T. Doan | 1994-09-06 |
| 5341016 | Low resistance device element and interconnection structure | Kirk D. Prall, Scott Meikle | 1994-08-23 |