Issued Patents All Time
Showing 25 most recent of 403 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10283553 | Visible and infrared image sensor | Eric A. G. Webster, Dominic Massetti | 2019-05-07 |
| 10002215 | Arrayed imaging systems having improved alignment and associated methods | Edward R. Dowski, Jr., Paulo E. X. Silveira, George C. Barnes, IV, Vladislav V. Chumachenko, Dennis W. Dobbs +17 more | 2018-06-19 |
| 9806122 | Visible and infrared image sensor | Eric A. G. Webster, Dominic Massetti | 2017-10-31 |
| 9748308 | Method of fabricating multi-wafer image sensor | Yin Qian, Dyson H. Tai, Jin Li, Chen Lu | 2017-08-29 |
| 9698185 | Partial buried channel transfer device for image sensors | Gang Chen, Sing-Chung Hu, Hsin-Chih Tai, Duli Mao, Manoj Bikumandla +5 more | 2017-07-04 |
| 9667895 | Stacked chip shared pixel architecture | Johannes Solhusvik, Jie Shen | 2017-05-30 |
| 9496304 | Image sensor pixel cell with switched deep trench isolation structure | Sing-Chung Hu, Rongsheng Yang, Gang Chen, Sohei Manabe, Dyson H. Tai | 2016-11-15 |
| 9418193 | Arrayed imaging systems having improved alignment and associated methods | Edward R. Dowski, Jr., Paulo E.X. Silvieri, George C. Barnes, IV, Vladislav V. Chumachenko, Dennis W. Dobbs +15 more | 2016-08-16 |
| 9419035 | Image sensor with color pixels having uniform light absorption depths | Fei Wu, Hongjun Li, Yin Qian, Hsin-Chih Tai, Jizhang Shan | 2016-08-16 |
| 9379159 | Method of fabricating multi-wafer image sensor | Yin Qian, Dyson H. Tai, Jin Li, Chen Lu | 2016-06-28 |
| 9305968 | Die seal ring for integrated circuit system with stacked device wafers | Yin Qian, Hsin-Chih Tai, Tiejun Dai, Duli Mao, Cunyu Yang | 2016-04-05 |
| 9305962 | Dual-facing camera assembly | Gang Chen, Ashish Shah, Duli Mao, Hsin-Chih Tai | 2016-04-05 |
| 9291755 | Color filter including clear pixel and hard mask | Gang Chen, Duli Mao, Hsin-Chih Tai | 2016-03-22 |
| 9236411 | Color filter patterning using hard mask | Gang Chen, Duli Mao, Hsin-Chih Tai | 2016-01-12 |
| 9177982 | Lateral light shield in backside illuminated imaging sensors | Duli Mao, Dyson H. Tai, Vincent Venezia, Yin Qian, Gang Chen | 2015-11-03 |
| 9165969 | Apparatus having thinner interconnect line for photodetector array and thicker interconnect line for periphery region | Duli Mao, Vincent Venezia, Hsin-Chih Tai, Yin Qian | 2015-10-20 |
| 9147776 | Negatively charged layer to reduce image memory effect | Dajiang Yang, Gang Chen, Duli Mao, Vincent Venezia | 2015-09-29 |
| 9142581 | Die seal ring for integrated circuit system with stacked device wafers | Yin Qian, Hsin-Chih Tai, Tiejun Dai, Duli Mao, Cunyu Yang | 2015-09-22 |
| 9105767 | Negatively charged layer to reduce image memory effect | Dajiang Yang, Gang Chen, Duli Mao, Vincent Venezia | 2015-08-11 |
| 9083899 | Circuit structure for providing conversion gain of a pixel array | Duli Mao, Vincent Venezia, Gang Chen, Hsin-Chih Tai | 2015-07-14 |
| 9054007 | Image sensor pixel cell with switched deep trench isolation structure | Sing-Chung Hu, Rongsheng Yang, Gang Chen, Sohei Manabe, Hsin-Chih Tai | 2015-06-09 |
| 9042697 | Resonator for thermo optic device | Gurtej S. Sandhu, Guy T. Blalock | 2015-05-26 |
| 8957359 | Compact in-pixel high dynamic range imaging | Gang Chen, Duli Mao, Hsin-Chih Tai | 2015-02-17 |
| 8952309 | Image sensor with micro-lens coating | Gang Chen, Hsin-Chih Tai, Duli Mao | 2015-02-10 |
| 8951910 | Methods for fabricating and forming semiconductor device structures including damascene structures | — | 2015-02-10 |