| 10283553 |
Visible and infrared image sensor |
Eric A. G. Webster, Dominic Massetti |
2019-05-07 |
|
| 10002215 |
Arrayed imaging systems having improved alignment and associated methods |
Edward R. Dowski, Jr., Paulo E. X. Silveira, George C. Barnes, IV, Vladislav V. Chumachenko, Dennis W. Dobbs +17 more |
2018-06-19 |
|
| 9806122 |
Visible and infrared image sensor |
Eric A. G. Webster, Dominic Massetti |
2017-10-31 |
|
| 9748308 |
Method of fabricating multi-wafer image sensor |
Yin Qian, Dyson H. Tai, Jin Li, Chen Lu |
2017-08-29 |
|
| 9698185 |
Partial buried channel transfer device for image sensors |
Gang Chen, Sing-Chung Hu, Hsin-Chih Tai, Duli Mao, Manoj Bikumandla +5 more |
2017-07-04 |
|
| 9667895 |
Stacked chip shared pixel architecture |
Johannes Solhusvik, Jie Shen |
2017-05-30 |
|
| 9496304 |
Image sensor pixel cell with switched deep trench isolation structure |
Sing-Chung Hu, Rongsheng Yang, Gang Chen, Sohei Manabe, Dyson H. Tai |
2016-11-15 |
|
| 9418193 |
Arrayed imaging systems having improved alignment and associated methods |
Edward R. Dowski, Jr., Paulo E.X. Silvieri, George C. Barnes, IV, Vladislav V. Chumachenko, Dennis W. Dobbs +15 more |
2016-08-16 |
|
| 9419035 |
Image sensor with color pixels having uniform light absorption depths |
Fei Wu, Hongjun Li, Yin Qian, Hsin-Chih Tai, Jizhang Shan |
2016-08-16 |
|
| 9379159 |
Method of fabricating multi-wafer image sensor |
Yin Qian, Dyson H. Tai, Jin Li, Chen Lu |
2016-06-28 |
|
| 9305968 |
Die seal ring for integrated circuit system with stacked device wafers |
Yin Qian, Hsin-Chih Tai, Tiejun Dai, Duli Mao, Cunyu Yang |
2016-04-05 |
|
| 9305962 |
Dual-facing camera assembly |
Gang Chen, Ashish Shah, Duli Mao, Hsin-Chih Tai |
2016-04-05 |
|
| 9291755 |
Color filter including clear pixel and hard mask |
Gang Chen, Duli Mao, Hsin-Chih Tai |
2016-03-22 |
|
| 9236411 |
Color filter patterning using hard mask |
Gang Chen, Duli Mao, Hsin-Chih Tai |
2016-01-12 |
$8,868,000 |
| 9177982 |
Lateral light shield in backside illuminated imaging sensors |
Duli Mao, Dyson H. Tai, Vincent Venezia, Yin Qian, Gang Chen |
2015-11-03 |
$5,342,000 |
| 9165969 |
Apparatus having thinner interconnect line for photodetector array and thicker interconnect line for periphery region |
Duli Mao, Vincent Venezia, Hsin-Chih Tai, Yin Qian |
2015-10-20 |
$3,614,000 |
| 9147776 |
Negatively charged layer to reduce image memory effect |
Dajiang Yang, Gang Chen, Duli Mao, Vincent Venezia |
2015-09-29 |
$3,356,000 |
| 9142581 |
Die seal ring for integrated circuit system with stacked device wafers |
Yin Qian, Hsin-Chih Tai, Tiejun Dai, Duli Mao, Cunyu Yang |
2015-09-22 |
$10,384,000 |
| 9105767 |
Negatively charged layer to reduce image memory effect |
Dajiang Yang, Gang Chen, Duli Mao, Vincent Venezia |
2015-08-11 |
$10,908,000 |
| 9083899 |
Circuit structure for providing conversion gain of a pixel array |
Duli Mao, Vincent Venezia, Gang Chen, Hsin-Chih Tai |
2015-07-14 |
$3,413,000 |
| 9054007 |
Image sensor pixel cell with switched deep trench isolation structure |
Sing-Chung Hu, Rongsheng Yang, Gang Chen, Sohei Manabe, Hsin-Chih Tai |
2015-06-09 |
$11,268,000 |
| 9042697 |
Resonator for thermo optic device |
Gurtej S. Sandhu, Guy T. Blalock |
2015-05-26 |
$11,470,000 |
| 8957359 |
Compact in-pixel high dynamic range imaging |
Gang Chen, Duli Mao, Hsin-Chih Tai |
2015-02-17 |
$6,460,000 |
| 8952309 |
Image sensor with micro-lens coating |
Gang Chen, Hsin-Chih Tai, Duli Mao |
2015-02-10 |
$6,730,000 |
| 8951910 |
Methods for fabricating and forming semiconductor device structures including damascene structures |
— |
2015-02-10 |
$7,791,000 |
