Issued Patents All Time
Showing 26–50 of 63 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6951624 | Method and apparatus of arrayed sensors for metrological control | Rodney Kistler, Aleksander Owczarz, David Hemker, Nicolas Bright | 2005-10-04 |
| 6951503 | System and method for in-situ measuring and monitoring CMP polishing pad thickness | Simon McClachie | 2005-10-04 |
| 6937915 | Apparatus and methods for detecting transitions of wafer surface properties in chemical mechanical polishing for process status and control | Rodney Kistler, David Hemker, Aleksander Owczarz, Bruno Morel, Damon Vincent Williams | 2005-08-30 |
| 6935938 | Multiple-conditioning member device for chemical mechanical planarization conditioning | Robert Charatan | 2005-08-30 |
| 6929531 | System and method for metal residue detection and mapping within a multi-step sequence | Aleksander Owczarz, David Hemker, Nicolas Bright, Rodney Kistler | 2005-08-16 |
| 6925348 | Methods for detecting transitions of wafer surface properties in chemical mechanical polishing for process status and control | Rodney Kistler, David Hemker, Aleksander Owczarz, Bruno Morel, Damon Vincent Williams | 2005-08-02 |
| 6922053 | Complementary sensors metrological process and method and apparatus for implementing the same | Rodney Kistler, Aleksander Owczarz, David Hemker, Nicolas Bright | 2005-07-26 |
| 6896596 | Polishing pad ironing system | Aleksander Owczarz, Rodney Kistler | 2005-05-24 |
| 6894491 | Method and apparatus for metrological process control implementing complementary sensors | Rodney Kistler, Aleksander Owczarz, David Hemker, Nicolas Bright | 2005-05-17 |
| 6878048 | CMP belt stretch compensation apparatus and methods for using the same | David Wei, Aleksander Owzarz | 2005-04-12 |
| 6869337 | System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques | John M. Boyd, Rod Kistler | 2005-03-22 |
| 6866567 | Activated slurry CMP system and methods for implementing the same | — | 2005-03-15 |
| 6859765 | Method and apparatus for slope to threshold conversion for process state monitoring and endpoint detection | Vladimir Katz, David Hemker, Rodney Kistler, Nicolas Bright | 2005-02-22 |
| 6808590 | Method and apparatus of arrayed sensors for metrological control | Rodney Kistler, Aleksander Owczarz, David Hemker, Nicolas Bright | 2004-10-26 |
| 6808442 | Apparatus for removal/remaining thickness profile manipulation | David Wei, Aleksander Owczarz, John M. Boyd, Rod Kistler | 2004-10-26 |
| 6788050 | System, method and apparatus for thin-film substrate signal separation using eddy current | — | 2004-09-07 |
| 6767428 | Method and apparatus for chemical mechanical planarization | Aleksandar Owczarz, Rod Kistler | 2004-07-27 |
| 6749491 | CMP belt stretch compensation apparatus and methods for using the same | David Wei, Aleksander Owzarz | 2004-06-15 |
| 6729943 | System and method for controlled polishing and planarization of semiconductor wafers | Rod Kistler | 2004-05-04 |
| 6726530 | End-point detection system for chemical mechanical polishing applications | Katrina Mikhaylich, Mike Ravkin | 2004-04-27 |
| 6719874 | Active retaining ring support | Aleksander Owczarz, Miguel Saldana, David Wei, Damon Vincent Williams | 2004-04-13 |
| 6716299 | Profiled retaining ring for chemical mechanical planarization | Aleksander Owczarz, Jeffrey Yung | 2004-04-06 |
| 6705930 | System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques | John M. Boyd, Rod Kistler | 2004-03-16 |
| 6676493 | Integrated planarization and clean wafer processing system | Aleksandar Owczarz | 2004-01-13 |
| 6656024 | Method and apparatus for reducing compressed dry air usage during chemical mechanical planarization | John M. Boyd, David Wei | 2003-12-02 |