Issued Patents All Time
Showing 26–50 of 52 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9970108 | Systems and methods for vapor delivery in a substrate processing system | Jun Qian, Purushottam Kumar, Chloe Baldasseroni, Heather Landis, Andrew Duvall +11 more | 2018-05-15 |
| 9966299 | Inhibitor plasma mediated atomic layer deposition for seamless feature fill | Wei Tang, Bart J. van Schravendijk, Jun Qian, Adrien LaVoie, Deenesh Padhi +1 more | 2018-05-08 |
| 9899195 | Systems and methods for removing particles from a substrate processing chamber using RF plasma cycling and purging | Adrien LaVoie | 2018-02-20 |
| 9870917 | Variable temperature hardware and methods for reduction of wafer backside deposition | Ishtak Karim, Purushottam Kumar, Jun Qian, Ramesh Chandrasekharan, Adrien LaVoie | 2018-01-16 |
| 9797042 | Single ALD cycle thickness control in multi-station substrate deposition systems | Romuald Nowak, Adrien LaVoie, Jun Qian | 2017-10-24 |
| 9793110 | Gapfill of variable aspect ratio features with a composite PEALD and PECVD method | Shankar Swaminathan, Jun Qian, Wanki Kim, Dennis M. Hausmann, Bart J. van Schravendijk +1 more | 2017-10-17 |
| 9793096 | Systems and methods for suppressing parasitic plasma and reducing within-wafer non-uniformity | Adrien LaVoie, Shankar Swaminathan, Jun Qian, Chloe Baldasseroni, Frank L. Pasquale +8 more | 2017-10-17 |
| 9786570 | Methods for depositing films on sensitive substrates | Shankar Swaminathan, Adrien LaVoie, Jon Henri | 2017-10-10 |
| 9745658 | Chamber undercoat preparation method for low temperature ALD films | Jun Qian, Adrien LaVoie | 2017-08-29 |
| 9738972 | Tandem source activation for CVD of films | Adrien LaVoie, Karl Leeser | 2017-08-22 |
| 9685320 | Methods for depositing silicon oxide | Wanki Kim, Adrien LaVoie | 2017-06-20 |
| 9624578 | Method for RF compensation in plasma assisted atomic layer deposition | Jun Qian, Frank L. Pasquale, Adrien LaVoie, Chloe Baldasseroni, Shankar Swaminathan +7 more | 2017-04-18 |
| 9617638 | Methods and apparatuses for showerhead backside parasitic plasma suppression in a secondary purge enabled ALD system | Adrien LaVoie, Purushottam Kumar, Shankar Swaminathan, Jun Qian, Frank L. Pasquale +1 more | 2017-04-11 |
| 9478408 | Systems and methods for removing particles from a substrate processing chamber using RF plasma cycling and purging | Adrien LaVoie | 2016-10-25 |
| 9425078 | Inhibitor plasma mediated atomic layer deposition for seamless feature fill | Wei Tang, Bart J. van Schravendijk, Jun Qian, Adrien LaVoie, Deenesh Padhi +1 more | 2016-08-23 |
| 9355839 | Sub-saturated atomic layer deposition and conformal film deposition | Shankar Swaminathan, Adrien LaVoie | 2016-05-31 |
| 9287113 | Methods for depositing films on sensitive substrates | Shankar Swaminathan, Adrien LaVoie, Jon Henri | 2016-03-15 |
| 9257274 | Gapfill of variable aspect ratio features with a composite PEALD and PECVD method | Shankar Swaminathan, Jun Qian, Wanki Kim, Dennis M. Hausmann, Bart J. van Schravendijk +1 more | 2016-02-09 |
| 9230800 | Plasma activated conformal film deposition | Adrien LaVoie, Shankar Swaminathan, Ramesh Chandrasekharan, Tom Dorsh, Dennis M. Hausmann +9 more | 2016-01-05 |
| 9145607 | Tandem source activation for cyclical deposition of films | Adrien LaVoie, Karl Leeser | 2015-09-29 |
| 8956704 | Methods for modulating step coverage during conformal film deposition | Shankar Swaminathan, Adrien LaVoie | 2015-02-17 |
| 8728956 | Plasma activated conformal film deposition | Adrien LaVoie, Shankar Swaminathan, Ramesh Chandrasekharan, Tom Dorsh, Dennis M. Hausmann +9 more | 2014-05-20 |
| 8524612 | Plasma-activated deposition of conformal films | Ming Li, Mandyam Sriram, Adrien LaVoie | 2013-09-03 |
| 8349222 | Twisted π-electron system chromophore compounds with very large molecular hyperpolarizabilities and related compositions and devices | Tobin J. Marks | 2013-01-08 |
| 8101531 | Plasma-activated deposition of conformal films | Ming Li, Mandyam Sriram, Adrien LaVoie | 2012-01-24 |