Issued Patents All Time
Showing 76–100 of 108 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6740970 | Semiconductor device with stack of semiconductor chips | Tetsuya Hiraoka | 2004-05-25 |
| 6653285 | Modulators of polysaccharides and uses thereof | Mark E. Mummert, Mansour Mohamadzadeh | 2003-11-25 |
| 6621169 | Stacked semiconductor device and method of producing the same | Katsuhito Kikuma, Mitsutaka Ikeda, Yoshihiro Tsukidate, Yuji Akashi, Kaname Ozawa +5 more | 2003-09-16 |
| 6528348 | Semiconductor device having protruding electrodes higher than a sealed portion | Fumihiko Ando, Hiroshi Onodera, Eiji Yoshida, Kazuo Teshirogi | 2003-03-04 |
| 6489676 | Semiconductor device having an interconnecting post formed on an interposer within a sealing resin | Fumihiko Taniguchi | 2002-12-03 |
| 6472746 | Semiconductor device having bonding wires serving as external connection terminals | Fumihiko Taniguchi | 2002-10-29 |
| 6457633 | Method of forming a BGA-type semiconductor device having reliable electrical connection for solder balls | Kazuya KAMIMURA, Yoshikazu Kumagaya | 2002-10-01 |
| 6404062 | Semiconductor device and structure and method for mounting the same | Fumihiko Taniguchi, Sachiko Nogami | 2002-06-11 |
| 6388333 | Semiconductor device having protruding electrodes higher than a sealed portion | Fumihiko Taniguchi, Kouhei Orikawa, Tadashi Uno, Fumihiko Ando, Hiroshi Onodera +2 more | 2002-05-14 |
| 6383842 | Method for producing semiconductor device having increased adhesion between package and semiconductor chip bottom | Mitsutaka Sato, Shinichirou Taniguchi | 2002-05-07 |
| 6281571 | Semiconductor device having an external connection electrode extending through a through hole formed in a substrate | Fumihiko Ando, Mitsuru Sato, Takashi Suzuki, Yoshikazu Kumagaya, Kazunari Kosakai | 2001-08-28 |
| 6166433 | Resin molded semiconductor device and method of manufacturing semiconductor package | Hidehiko Akasaki, Haruo Kojima, Fumihiko Taniguchi, Kazunari Kosakai, Koji Honna +1 more | 2000-12-26 |
| 6160313 | Semiconductor device having an insulating substrate | Fumihiko Taniguchi, Toshihisa Higashiyama | 2000-12-12 |
| 6046158 | Unique dendritic cell-associated C-type lectins, dectin-1 and dectin-2; compositions and uses thereof | Kiyoshi Ariizumi | 2000-04-04 |
| 5970161 | Speaker system for a video monitor and a video monitor equipped with a speaker system | Yuichi Komatsu, Nobuo Miura, Masayuki Hashimoto, Nobuyuki Mukaino | 1999-10-19 |
| 5834831 | Semiconductor device with improved heat dissipation efficiency | Akihiro Kubota, Yuichi Asano, Koichi Sibasaki, Kazuhiro Yonetake, Tsuyoshi Aoki | 1998-11-10 |
| 5821613 | Semiconductor device in which semiconductor chip has bottom surface with reduced level of organic compounds relatively to other sufaces thereof | Mitsutaka Sato, Shinichirou Taniguchi | 1998-10-13 |
| 5801439 | Semiconductor device and semiconductor device unit for a stack arrangement | Tetsuya Fujisawa, Mitsutaka Sato, Junichi Kasai, Masataka Mizukoshi, Kosuke Otokita +4 more | 1998-09-01 |
| 5760471 | Semiconductor device having an inner lead extending over a central portion of a semiconductor device sealed in a plastic package and an outer lead exposed to the outside of a side face of the plastic package | Tetsuya Fujisawa, Mitsutaka Sato, Junichi Kasai, Masataka Mizukoshi, Kousuke Otokita +4 more | 1998-06-02 |
| D387360 | Backhoe | Masahiro Ishizaki, Tadashi Kusunoki, Masahiko Kobayashi | 1997-12-09 |
| D383469 | Backhoe | Masahiro Ishizaki, Tadashi Kusunoki, Masahiko Kobayashi | 1997-09-09 |
| 5648681 | Semiconductor device having a supporting lead to support a bypass lead portion | Hiroshi Yoshimura, Kosuke Otokita | 1997-07-15 |
| 5476012 | Air flow sensor with swirl generator | — | 1995-12-19 |
| 5447888 | Process of ejecting an encapsulated semiconductor device from a mold by directly contacting exterior leads with ejector pins | Toshiyuki Honda, Masaki Waki | 1995-09-05 |
| D341535 | Letter opener | — | 1993-11-23 |