Issued Patents All Time
Showing 26–44 of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10229827 | Method of redistribution layer formation for advanced packaging applications | Han-Wen Chen, Steven Verhaverbeke, Roman Gouk, Guan Huei See, Arvind Sundarrajan | 2019-03-12 |
| 10211072 | Method of reconstituted substrate formation for advanced packaging applications | Han-Wen Chen, Steven Verhaverbeke, Roman Gouk, Guan Huei See, Arvind Sundarrajan +3 more | 2019-02-19 |
| 10170385 | Semiconductor device and method of forming stacked vias within interconnect structure for FO-WLCSP | Yaojian Lin, Rui Huang, Kang Chen | 2019-01-01 |
| 10049964 | Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect units | Il Kwon Shim, Yaojian Lin, Pandi C. Marimuthu, Kang Chen | 2018-08-14 |
| 9875973 | Semiconductor device and method for forming semiconductor package having build-up interconnect structure over semiconductor die with different CTE insulating layers | Yaojian Lin, Kang Chen, Wei Meng, Chee Siang Ong | 2018-01-23 |
| 9865525 | Semiconductor method and device of forming a fan-out PoP device with PWB vertical interconnect units | Yaojian Lin, Pandi C. Marimuthu, Kang Chen | 2018-01-09 |
| 9842798 | Semiconductor device and method of forming a PoP device with embedded vertical interconnect units | Pandi C. Marimuthu, Yaojian Lin, Kang Chen, Won Kyoung Choi | 2017-12-12 |
| 9837303 | Semiconductor method and device of forming a fan-out device with PWB vertical interconnect units | Yaojian Lin, Kang Chen, Pandi C. Marimuthu | 2017-12-05 |
| 9666500 | Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief | Yaojian Lin, Pandi C. Marimuthu, Kang Chen, Hin Hwa Goh, Il Kwon Shim +4 more | 2017-05-30 |
| 9520365 | Semiconductor device and method for forming semiconductor package having build-up interconnect structure over semiconductor die with different CTE insulating layers | Yaojian Lin, Kang Chen, Wei Meng, Chee Siang Ong | 2016-12-13 |
| 9385102 | Semiconductor device and method of forming supporting layer over semiconductor die in thin fan-out wafer level chip scale package | Yaojian Lin, Kang Chen | 2016-07-05 |
| 9318404 | Semiconductor device and method of forming stress relieving vias for improved fan-out WLCSP package | Yaojian Lin, Pandi C. Marimuthu, Kang Chen | 2016-04-19 |
| 9252092 | Semiconductor device and method of forming through mold hole with alignment and dimension control | Yaojian Lin, Kang Chen | 2016-02-02 |
| 9087930 | Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief | Yaojian Lin, Pandi C. Marimuthu, Kang Chen, Hin Hwa Goh, Il Kwon Shim +4 more | 2015-07-21 |
| 9082780 | Semiconductor device and method of forming a robust fan-out package including vertical interconnects and mechanical support layer | Yaojian Lin, Kang Chen | 2015-07-14 |
| 8810024 | Semiconductor method and device of forming a fan-out PoP device with PWB vertical interconnect units | Yaojian Lin, Pandi C. Marimuthu, Kang Chen | 2014-08-19 |
| 8759155 | Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief | Yaojian Lin, Pandi C. Marimuthu, Kang Chen, Hin Hwa Goh, Il Kwon Shim +4 more | 2014-06-24 |
| 8492203 | Semiconductor device and method for forming semiconductor package having build-up interconnect structure over semiconductor die with different CTE insulating layers | Yaojian Lin, Kang Chen, Wei Meng, Chee Siang Ong | 2013-07-23 |
| 8456002 | Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief | Yaojian Lin, Pandi C. Marimuthu, Kang Chen, Hin Hwa Goh, Il Kwon Shim +4 more | 2013-06-04 |