SS

Sung-Min Sim

Samsung: 14 patents #9,740 of 75,807Top 15%
Overall (All Time): #354,568 of 4,157,543Top 9%
14
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
7855144 Method of forming metal lines and bumps for semiconductor devices Soon-Bum Kim, Dong-Hyeon Jang, Jae-Sik Chung, Se-Yong Oh 2010-12-21
7825495 Semiconductor chip structure, method of manufacturing the semiconductor chip structure, semiconductor chip package, and method of manufacturing the semiconductor chip package Seung-Kwan Ryu, Hee-Kook Choi, Dong-Hyeon Jang 2010-11-02
7732319 Interconnection structure of integrated circuit chip Se-Young Jeong, Soon-Bum Kim, In-Young Lee, Young-Hee Song 2010-06-08
7524763 Fabrication method of wafer level chip scale packages Soon-Bum Kim, Ung-Kwang Kim, Keum-Hee Ma, Young-Hee Song, Se-Yong Oh +2 more 2009-04-28
7312143 Wafer level chip scale package having a gap and method for manufacturing the same Myeong-Soon Park, Hyun-Soo Chung, In-Young Lee, Jae-Sik Chung, Dong-Hyeon Jang +2 more 2007-12-25
7307342 Interconnection structure of integrated circuit chip Se-Young Jeong, Soon-Bum Kim, In-Young Lee, Young-Hee Song 2007-12-11
7205660 Wafer level chip scale package having a gap and method for manufacturing the same Myeong-Soon Park, Hyun-Soo Chung, In-Young Lee, Jae-Sik Chung, Dong-Hyeon Jang +2 more 2007-04-17
7151009 Method for manufacturing wafer level chip stack package Soon-Bum Kim, Ung-Kwang Kim, Kang-Wook Lee, Se-Young Jeong, Young-Hee Song 2006-12-19
6423654 Method of manufacturing a semiconductor device having silicon oxynitride passavation layer Young-Goan Jang 2002-07-23
5933708 Lead-on-chip semiconductor package and method for making the same Young-Hee Song, Young Do Kweon, Hai-Jeong Sohn 1999-08-03
5840614 Method of producing a semiconductor wafer using ultraviolet sensitive tape Do-yun Hwang 1998-11-24
5753532 Method of manufacturing semiconductor chip package 1998-05-19
5633206 Process for manufacturing lead frame for semiconductor package Sang Hoon Kim, In Pyo Hong, Sang-Gil Lee 1997-05-27
5543493 Method for treating a polyimide surface Chan Eon Park, Hwang Kyu Yun, Wan Choi 1996-08-06