Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6629876 | Apparatus for grinding wafers using a grind chuck having a high elastic modulus | Bae-seung Park, Jin Heung Kim | 2003-10-07 |
| 6269281 | Back lapping in-line system for semiconductor device fabrication | Jin Heung Kim | 2001-07-31 |
| 6193586 | Method and apparatus for grinding wafers using a grind chuck having high elastic modulus | Bae-seung Park, Jin Heung Kim | 2001-02-27 |
| 5840614 | Method of producing a semiconductor wafer using ultraviolet sensitive tape | Sung-Min Sim | 1998-11-24 |