Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6629876 | Apparatus for grinding wafers using a grind chuck having a high elastic modulus | Jin Heung Kim, Do-yun Hwang | 2003-10-07 |
| 6193586 | Method and apparatus for grinding wafers using a grind chuck having high elastic modulus | Jin Heung Kim, Do-yun Hwang | 2001-02-27 |
| 6039830 | Method of and apparatus for laminating a semiconductor wafer with protective tape | Jin Heung Kim, Jung-Hyun Cho | 2000-03-21 |