Issued Patents All Time
Showing 25 most recent of 128 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12154890 | Multi-tier IC package including processor and high bandwidth memory | Rui Niu, Tianqiang Huang | 2024-11-26 |
| 12027512 | Chipset and manufacturing method thereof | Linglan Zhang | 2024-07-02 |
| 11719584 | Complementary ring oscillators to monitor in-situ stress within integrated circuits | Hong Liu | 2023-08-08 |
| 11688704 | Merged power pad for improving integrated circuit power delivery | Jinghua Zhu, Hongying Zhang, Jun Xia, Wangsheng Xie, Shuangfu Wang +3 more | 2023-06-27 |
| 11545467 | IC die to IC die interconnect using error correcting code and data path interleaving | — | 2023-01-03 |
| 11233025 | Merged power pad for improving integrated circuit power delivery | Jinghua Zhu, Hongying Zhang, Jun Xia, Wangsheng Xie, Shuangfu Wang +3 more | 2022-01-25 |
| 11101224 | Wrapped signal shielding in a wafer fanout package | Tiejun Liu, Zhao Chen | 2021-08-24 |
| 10971476 | Bottom package with metal post interconnections | Ratibor Radojcic, Dong Wook Kim | 2021-04-06 |
| 10944379 | Hybrid passive-on-glass (POG) acoustic filter | David Francis Berdy, Changhan Hobie Yun, Niranjan Sunil Mudakatte, Mario Francisco Velez, Chengjie Zuo +1 more | 2021-03-09 |
| 10903240 | Integrated circuits (ICs) on a glass substrate | Daniel Daeik Kim, Matthew Michael Nowak, Jonghae Kim, Changhan Hobie Yun, Je-Hsiung Lan +1 more | 2021-01-26 |
| 10672730 | Semiconductor package having reduced internal power pad pitch | Hongying Zhang, HongLiang Cai | 2020-06-02 |
| 10658335 | Heterogenous 3D chip stack for a mobile processor | Yu Lin, Jinghua Zhu, Guofang Jiao | 2020-05-19 |
| 10523253 | Glass substrate including passive-on-glass device and semiconductor die | Changhan Hobie Yun, Chengjie Zuo, Mario Francisco Velez, Niranjan Sunil Mudakatte, Jonghae Kim +1 more | 2019-12-31 |
| 10498307 | Integrated device comprising a capacitor and inductor structure comprising a shared interconnect for a capacitor and an inductor | Mario Francisco Velez, Niranjan Sunil Mudakatte, Jonghae Kim, Changhan Hobie Yun, David Francis Berdy +1 more | 2019-12-03 |
| 10332911 | Integrated circuits (ICs) on a glass substrate | Daeik Daniel Kim, Matthew Michael Nowak, Jonghae Kim, Changhan Hobie Yun, Je-Hsiung Lan +1 more | 2019-06-25 |
| 10312193 | Package comprising switches and filters | Chengjie Zuo, Steve Fanelli, Husnu Ahmet Masaracioglu | 2019-06-04 |
| 10304792 | Semiconductor package having reduced internal power pad pitch | Hongying Zhang, HongLiang Cai | 2019-05-28 |
| 10290579 | Utilization of backside silicidation to form dual side contacted capacitor | Sinan Goktepeli, Plamen Vassilev Kolev, Michael A. Stuber, Richard Hammond, Steve Fanelli | 2019-05-14 |
| 10271745 | Monolithic integrated emitter-detector array in a flexible substrate for biometric sensing | Matthew Michael Nowak, Kenneth Kaskoun, Eugene Dantsker, Russel A. Martin | 2019-04-30 |
| 10256863 | Monolithic integration of antenna switch and diplexer | Chengjie Zuo, Steve Fanelli, Thomas A. Gee, Young Kyu Song | 2019-04-09 |
| 10182728 | Multi-sensor device and method of using multi-sensor device for determining biometric properties of a subject | David Boettcher Baek, Eugene Dantsker | 2019-01-22 |
| 10163771 | Interposer device including at least one transistor and at least one through-substrate via | Chengjie Zuo, Changhan Hobie Yun, David Francis Berdy, Niranjan Sunil Mudakatte, Mario Francisco Velez +1 more | 2018-12-25 |
| 10157823 | High density fan out package structure | Dong Wook Kim, Hong Bok We, Jae Sik Lee | 2018-12-18 |
| 10158030 | CMOS and bipolar device integration including a tunable capacitor | Gengming Tao, Richard Hammond, Ranadeep Dutta, Matthew Michael Nowak, Francesco Carobolante | 2018-12-18 |
| 10141908 | Multi-density MIM capacitor for improved passive on glass (POG) multiplexer performance | Niranjan Sunil Mudakatte, David Francis Berdy, Changhan Hobie Yun, Chengjie Zuo, Mario Francisco Velez +1 more | 2018-11-27 |